Packaging Substrate Development Engineer

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: In this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap. THE PERSON: Ideal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams. KEY RESPONSIBILITIES: · Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors · Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements · Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks. · Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI. · Qualify package substrates of new products meeting cost and yield targets. PREFERRED EXPERIENCE: · Experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up. · Communicating complex technical challenges to executive level/management. Deep knowledge of packaging and board design rules, process flows, materials, and equipment. · Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors ACADEMIC CREDENTIALS: · BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent. This role is not eligible for Visa Sponsorship. #LI-HYBRID #LI-AP1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. THE ROLE: In this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap. THE PERSON: Ideal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams. KEY RESPONSIBILITIES: · Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors · Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements · Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks. · Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI. · Qualify package substrates of new products meeting cost and yield targets. PREFERRED EXPERIENCE: · Experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up. · Communicating complex technical challenges to executive level/management. Deep knowledge of packaging and board design rules, process flows, materials, and equipment. · Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors ACADEMIC CREDENTIALS: · BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent. This role is not eligible for Visa Sponsorship. #LI-HYBRID #LI-AP1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.