TW_汽車電子封裝_Packaging Development Engineer (ASIC)

Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch. 博世集團於1990 年開始在台灣營運，2006年10月整合台灣地區各事業單位，成立在台事業總部，命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展，目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。 在台灣，博世同時也致力於履行企業社會責任，長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年，台灣博世展開長期的「博世成就愛」社會公益計畫，並舉辦了數場提倡摩托車道路安全的校園宣導活動，同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。 台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活，在全球透過創新及激發熱情的產品與服務，提升人們的生活品質。簡言之，博世期許能「以科技成就生活之美 」。 Job Description We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset, and a passion for continuous learning. In this role, you will define, develop, and qualify robust packaging solutions. Your core tasks include: • Package Design & Process Development: Drive design, material selection, and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams. • Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks. • OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control. • NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006). • Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design, test, and quality management teams. Qualifications Technical Experience & Capabilities • Education & Experience: Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related disciplines, with 3+ years of experience in semiconductor packaging engineering. • Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP). • Problem-Solving Skills: Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D, statistic, etc…) • Supplier Management: Proven ability to steer collaboration with external suppliers Language & Travel Requirements • Language Skills: Excellent English (verbal and written, min. C1 level) for international collaboration, paired with professional Mandarin Chinese for technical discussions with local teams and regional suppliers. • Travel: Flexibility to travel to overseas supplier sites and OSAT manufacturing facilities according to project needs.