Modelisation of light matter interaction for temporary bonding applications

As the semiconductor industry shifts toward advanced system‑level integration, temporary wafer bonding and debonding has become essential for handling thin wafers and complex packaging flows. This internship focuses on improving a technique that enables the use of standard Si wafers as temporary carriers , offering a low‑cost and process‑friendly solution. The main objective is to model the interaction between infrared laser light and debonding stacj to support heat‑based debonding . The work will involve simulating laser absorption, predicting temperature evolution, and identifying process conditions that allow reliable, selective release of the device wafer. The results will guide the development of a robust and efficient laser‑assisted temporary bonding approach. Type of internship : Master internship Duration : 6 months Required educational background : Materials Engineering, Physics, Nanoscience & Nanotechnology University promotor : Clement Merckling (KU Leuven) Supervising scientist(s) : For further information or for application, please contact Francois Chancerel ( Francois.Chancerel@imec.be ) and John Slabbekoorn ( John.Slabbekoorn@imec.be ) The reference code for this position is 2026-INT-147 . Mention this reference code in your application. Imec allowance will be provided for students studying at a non-Belgian university. Applications should include the following information: resume motivation current study Incomplete applications will not be considered