Senior Staff Reliability Engineer

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them. AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger — technology that moves the world forward. THE ROLE: Join a dynamic global team focused on advancing package reliability testing at the board and system level for AMD's cutting-edge processor and accelerator products that employ innovative chiplet and CoWoS/3DIC technologies. Be part of the team defining the reliability foundation for the next generation of AI infrastructure, Silicon Photonics, Co-Packaged Optics (CPO), advanced packaging, and high-speed I/O technologies. Working closely with teams across AMD Global Operations, Product Development, Silicon Design, Packaging, Manufacturing, Quality, and external technology partners, you will lead reliability initiatives spanning device, package, board, and system levels. You will drive qualification strategies, solve complex reliability challenges, and influence key technology decisions from early development through high-volume production. This role offers a unique opportunity to tackle some of the industry's most demanding reliability problems, including photonic devices, optical interconnects, heterogeneous integration, chiplets, and advanced semiconductor packaging, while delivering impactful solutions that ensure AMD's product quality and reliability THE PERSON: You are a proactive, independent subject matter expert who enjoys tackling complex reliability challenges in advanced semiconductor packaging and high-speed interconnect technologies. You thrive in a collaborative, fast-paced environment, working across Reliability, Design, Photonics, Packaging, Product Engineering, Manufacturing, Quality, and external partners to develop next-generation products that power AI, datacenter, and networking innovations. You bring strong technical, analytical, and problem-solving skills, with the ability to translate complex data into actionable insights, drive root-cause investigations, and influence key engineering decisions. As a proactive self-starter, you embrace ownership, anticipate future challenges, and deliver innovative solutions under demanding timelines while continuously raising the bar for product reliability and quality. KEY RESPONSIBILITIES: • Own and drive reliability strategies for next-generation AI products that may include Silicon Photonics, CPO, advanced packaging, and high-speed I/O technologies. • Define and execute qualification and reliability test plans that enable industry-leading AI and datacenter products. • Develop, optimize, and automate board, system, package, optical, and AI reliability methodologies to enable product readiness. • Solve complex reliability challenges through advanced characterization, failure analysis, custom AI agents, and data-driven insights. • Analyze reliability data and translate insights into actionable improvements that enhance product quality, robustness, and customer confidence. • Influence technology and product development decisions through data-driven engineering recommendations and reliability expertise. • Drive continuous innovation in reliability engineering to enable next-generation AI, datacenter, networking, and optical connectivity solutions. PREFERRED EXPERIENCE: • Experience in reliability, qualification, photonics, high-speed interconnect, semiconductor, or datacenter technologies. • Experience in one or more areas: semiconductor devices, advanced packaging, Silicon Photonics, optical interconnects, high-speed I/O, or board/system-level reliability. • Strong knowledge of reliability qualification methodologies, accelerated stress testing, reliability modeling, failure analysis, and applicable industry standards (e.g., JEDEC, GR-468, IPC). • Experience driving NPI qualification and product readiness, including risk assessment, qualification planning, and cross-functional execution from development to production. • Strong analytical and problem-solving skills with experience in reliability data analysis, root cause investigation, FMEA, DOE, and corrective/preventive actions. • Proven ability to collaborate across Reliability, Design, Product Engineering, Quality, Manufacturing, Supply Chain, and external partners to deliver robust products. • Experience with optical characterization, optical packaging, fiber-to-chip coupling, photonic devices, and optical/electrical test equipment is highly desirable. • Familiarity with high-speed SerDes, signal integrity, advanced packaging (2.5D/3D, chiplets, heterogeneous integration), CPO/NPO architectures, and simulation/modeling tools is a plus. • Self-driven technical leader with strong analytical skills and a passion for enabling next-generation AI, networking, and optical connectivity technologies through innovative reliability solutions. ACADEMIC CREDENTIALS: • Bachelor’s degree or above in Electrical/Electronics Engineering, Computer Engineering, Optics & Photonics Engineering, or comparable disciplines. LOCATION: Singapore #LI-CC6 #LI-HYBRID #LI-D&I Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. THE ROLE: Join a dynamic global team focused on advancing package reliability testing at the board and system level for AMD's cutting-edge processor and accelerator products that employ innovative chiplet and CoWoS/3DIC technologies. Be part of the team defining the reliability foundation for the next generation of AI infrastructure, Silicon Photonics, Co-Packaged Optics (CPO), advanced packaging, and high-speed I/O technologies. Working closely with teams across AMD Global Operations, Product Development, Silicon Design, Packaging, Manufacturing, Quality, and external technology partners, you will lead reliability initiatives spanning device, package, board, and system levels. You will drive qualification strategies, solve complex reliability challenges, and influence key technology decisions from early development through high-volume production. This role offers a unique opportunity to tackle some of the industry's most demanding reliability problems, including photonic devices, optical interconnects, heterogeneous integration, chiplets, and advanced semiconductor packaging, while delivering impactful solutions that ensure AMD's product quality and reliability THE PERSON: You are a proactive, independent subject matter expert who enjoys tackling complex reliability challenges in advanced semiconductor packaging and high-speed interconnect technologies. You thrive in a collaborative, fast-paced environment, working across Reliability, Design, Photonics, Packaging, Product Engineering, Manufacturing, Quality, and external partners to develop next-generation products that power AI, datacenter, and networking innovations. You bring strong technical, analytical, and problem-solving skills, with the ability to translate complex data into actionable insights, drive root-cause investigations, and influence key engineering decisions. As a proactive self-starter, you embrace ownership, anticipate future challenges, and deliver innovative solutions under demanding timelines while continuously raising the bar for product reliability and quality. KEY RESPONSIBILITIES: • Own and drive reliability strategies for next-generation AI products that may include Silicon Photonics, CPO, advanced packaging, and high-speed I/O technologies. • Define and execute qualification and reliability test plans that enable industry-leading AI and datacenter products. • Develop, optimize, and automate board, system, package, optical, and AI reliability methodologies to enable product readiness. • Solve complex reliability challenges through advanced characterization, failure analysis, custom AI agents, and data-driven insights. • Analyze reliability data and translate insights into actionable improvements that enhance product quality, robustness, and customer confidence. • Influence technology and product development decisions through data-driven engineering recommendations and reliability expertise. • Drive continuous innovation in reliability engineering to enable next-generation AI, datacenter, networking, and optical connectivity solutions. PREFERRED EXPERIENCE: • Experience in reliability, qualification, photonics, high-speed interconnect, semiconductor, or datacenter technologies. • Experience in one or more areas: semiconductor devices, advanced packaging, Silicon Photonics, optical interconnects, high-speed I/O, or board/system-level reliability. • Strong knowledge of reliability qualification methodologies, accelerated stress testing, reliability modeling, failure analysis, and applicable industry standards (e.g., JEDEC, GR-468, IPC). • Experience driving NPI qualification and product readiness, including risk assessment, qualification planning, and cross-functional execution from development to production. • Strong analytical and problem-solving skills with experience in reliability data analysis, root cause investigation, FMEA, DOE, and corrective/preventive actions. • Proven ability to collaborate across Reliability, Design, Product Engineering, Quality, Manufacturing, Supply Chain, and external partners to deliver robust products. • Experience with optical characterization, optical packaging, fiber-to-chip coupling, photonic devices, and optical/electrical test equipment is highly desirable. • Familiarity with high-speed SerDes, signal integrity, advanced packaging (2.5D/3D, chiplets, heterogeneous integration), CPO/NPO architectures, and simulation/modeling tools is a plus. • Self-driven technical leader with strong analytical skills and a passion for enabling next-generation AI, networking, and optical connectivity technologies through innovative reliability solutions. ACADEMIC CREDENTIALS: • Bachelor’s degree or above in Electrical/Electronics Engineering, Computer Engineering, Optics & Photonics Engineering, or comparable disciplines. LOCATION: Singapore #LI-CC6 #LI-HYBRID #LI-D&I Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.