Process Integration Engineer

Company: RF360 Singapore Pte., Ltd. Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Key Responsibilities Yield Improvement and Failure Analysis • Own overall Front-End process yield performance and drive continuous yield improvement initiatives. • Perform comprehensive wafer scrap analysis and identify root causes of yield loss through data-driven investigations. • Partner closely with process module engineers, manufacturing, quality, and equipment teams to resolve process-related yield excursions. • Develop and implement effective corrective, and preventive actions to eliminate recurrence of process and quality issues. • Lead cross-functional investigations and continuous improvement projects to improve process capability and manufacturing robustness. • Capture lessons learned into organizational knowledge databases to ensure long-term sustainability. Process Optimization and Development • Design, execute, and analyze Design of Experiments to optimize process conditions and establish robust manufacturing windows. • Evaluate process performance using statistical techniques and advanced quality tools. • Identify opportunities for baseline yield, cycle-time, and cost improvements across Front-End processes. • Support new technology introductions, process qualifications, and industrialization activities. Process Change Management • Plan, coordinate, and execute process changes through Limited Change Requests, ECNs, and qualification activities. • Assess manufacturing risks associated with process modifications and ensure successful implementation without adverse impact on yield, quality, reliability, or customer requirements. • Monitor post-implementation performance and drive timely closure of action items. Process Transfer and Production Ramp • Support engineering runs, process flow creation, and manufacturing readiness activities for new products and technologies. • Coordinate required tooling, accessories, documentation, and process setup activities. • Review engineering lot results and ensure smooth transition into volume production. • Monitor initial production performance and drive corrective actions where required. Design for Manufacturability • Drive Design for Manufacturability initiatives to improve product yield, quality, reliability, and manufacturability. • Collaborate with product design, process development, and technology development teams to identify and mitigate design-related process risks. • Evaluate defect mechanisms, process limitations, critical dimensions, and layout sensitivities that may impact manufacturing performance. • Support development and validation of new design concepts to achieve robust manufacturing performance. • Provide process capability feedback during product development to ensure compliance with manufacturing design rules and process constraints. Cross-Functional Collaboration • Work closely with Technology Development teams in Singapore and other development sites on new industrialization projects. • Provide technical leadership and integration support across process, equipment, manufacturing, quality, and product engineering functions. • Communicate technical findings, risk assessments, and recommendations effectively to management and stakeholders. Key Performance Indicators The incumbent will be evaluated based on manufacturing performance, technical execution, cross-functional effectiveness, and compliance discipline. • Achievement of Front-End yield targets and manufacturing output objectives. • Reduction of wafer scrap, process defects, and chronic quality issues. • Improvement in process quality, reliability, cost performance, and process robustness. • Timely completion of yield investigations, root-cause reports, and recommended actions, with target response within 5 working days for major yield or quality excursions. • Successful execution of process optimization and transfer projects according to agreed timelines without compromising quality or product performance. • Minimal customer complaints and zero customer returns attributed to Front-End process issues. • Effective implementation of DFM initiatives with no design-related yield or quality escapes. • Full compliance with CSR, EHS, ESD, 5S, and cleanroom protocol requirements. Education and Experience Requirements Education Bachelor’s Degree in Electrical Engineering, Electronics Engineering, Materials Engineering, Microelectronics, Semiconductor Engineering, or an equivalent discipline. Experience Experience in semiconductor wafer fabrication or high-volume electronics manufacturing. Front-End semiconductor process integration experience is highly preferred. Advantageous Background Hands-on involvement in new technology introduction, process qualification, industrialization, manufacturing ramp-up, yield enhancement, or process control methodologies. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. 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