Senior Staff Engineer, EMC Materials and Package Definition

Join us as a Senior Staff Engineer, EMC Materials and Package Definition, where you will play a key role in shaping material solutions for next-generation power semiconductor packages. This role combines deep EMC material expertise with package definition responsibilities to help deliver reliable, manufacturable, and cost-effective packaging solutions. About the Role As the material-focused technical lead, you will guide EMC ( Epoxymoulding Compound) material selection, development, evaluation, and qualification from early package concept through implementation. You will collaborate with global engineering, manufacturing, quality, procurement, suppliers, and business teams to ensure material choices meet package performance, reliability, process, and customer requirements. Your role Key responsibilities in your new role • Lead EMC material development, evaluation, qualification, and change projects in alignment with package technology roadmaps. • Define material requirements for new packages, considering package compatibility, manufacturability, reliability, cost, and supplier readiness. • Partner with package design, assembly, reliability, and process teams to translate package concepts into practical EMC material solutions. • Assess how EMC materials influence package performance, moldability, stress behavior, reliability, and customer application needs. • Own EMC material specifications, technical documentation, BOM recommendations, and qualification planning. • Lead problem-solving activities for EMC-related development, manufacturing, reliability, and customer issues. • Collaborate closely with suppliers and cross-functional partners to identify, benchmark, and introduce new EMC technologies. • Share technical expertise and provide guidance and mentorship to engineers working on EMC materials, package definition, and assembly technologies. Your profile Qualifications and skills to help you succeed • Degree in Materials Science, Polymer Chemistry, Chemistry, Semiconductor Technology, Microelectronics, Mechanical Engineering, or a related field; MSc or PhD is preferred. • At least 5 years of experience in EMC material development, semiconductor packaging, Back-End Assembly, package development, or related R&D or operations roles. • Solid knowledge of EMC formulation, material characterization, package reliability, assembly process integration, and failure analysis. • Experience working with material suppliers and cross-functional engineering teams in a global environment. • Ability to understand and apply analysis results such as mold flow analysis, thermo-mechanical analysis, thermal analysis, or reliability assessments is an advantage. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Mandy Neoh