Mixed-Signal Chiplet Architect

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X). Position Overview We are seeking a highly skilled Mixed-signal IC Chiplet Architect to lead the definition, design, and integration of next-generation chiplet-based analog and mixed-signal transceivers. This role requires deep technical expertise in analog integrated circuit design, system partitioning, and heterogeneous integration. The ideal candidate will provide architectural leadership from concept through product delivery, working cross-functionally with design, packaging, verification, software, firmware, evaluation and device test as part of a system engineering team. Key Responsibilities • Architecture & SpecificationDefine the architecture of analog and mixed-signal transceiver chiplets for advanced heterogeneous integration.Develop system-level specifications, interface definitions, and performance requirements.Develop sub-system requirements within the chiplet to achieve system level performance goals.Work with software architects to define and develop software and firmware for fast configuration and real time chiplet control. • Design LeadershipGuide design teams in integrating analog building blocks (e.g. RFADCs/RFDACs, Bias circuits, clock structures, PLLs, LDOs, drivers).Collaborate with digital, RF, and packaging teams to ensure seamless chiplet operation and interoperability.Work with system engineers to define and integrate fast switching clock synchronization schemes. • Integration & VerificationWork with 2D/2.5D integration teams to define chiplet interconnect requirements and physical integration strategies.Oversee system-level verification, modeling, and simulation of multi-chiplet systems.Drive signal integrity, power integrity, and thermal considerations at the multi-chiplet level. • Innovation & RoadmappingStay at the forefront of industry trends in chiplet architectures, heterogeneous integration, and advanced packaging.Contribute to the company’s technology roadmaps, identifying opportunities for differentiation in performance, efficiency, and scalability. • Collaboration & MentorshipAct as a technical leader, mentoring junior engineers and influencing best practices in mixed-signal IC design and chiplet integration.Communicate complex trade-offs and recommendations to management. Qualifications • Education:MS or PhD in Electrical Engineering or Systems Engineering. • Experience:10+ years of experience in analog/mixed-signal IC design, with at least 3 years in chiplet or multi-die system architecture.Track record of architecting and delivering high-performance analog ICs.Experience with advanced packaging and chiplet-based integration. • Technical Expertise:Strong foundation in analog/mixed-signal circuit design (ADC/DACs, Clocking, Biasing, Digital, and software/firmware based control).Knowledge of die-to-die interconnect protocols a plus.Familiarity with EDA tools for circuit, system, and packaging co-simulation. • Soft Skills:Strong leadership, problem-solving, and communication skills.Ability to balance innovation with practical constraints in time-to-market and manufacturability. Why Join Us? This is a opportunity to shape the future of chiplet-based architectures in a rapidly evolving semiconductor landscape. You will work on cutting-edge technologies, influence next-generation system designs, and have direct impact on products that push the boundaries of performance and integration. #LI-PG1 For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process. Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law. Job Req Type: Experienced Required Travel: No Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $157,080 to $227,460. • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.