Packaging Engineer

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them. AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger — technology that moves the world forward. THE ROLE: Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements. THE PERSON: This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly. KEY RESPONSIBILITIES: • Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables. • Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs. • Establish ecosystem partners to identify assembly capability improvement roadmap PREFERRED EXPERIENCE: • Demonstrated leadership skills in managing OSATs and teams with various backgrounds • In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc.. • Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience. • Well verse in typical technology development tools, FMEA, SPC, control plans, etc.. • Ability to communicate well in both English and Chinese language ACADEMIC CREDENTIALS: • Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent. LOCATION: Hsinchu, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. THE ROLE: Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements. THE PERSON: This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly. KEY RESPONSIBILITIES: • Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables. • Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs. • Establish ecosystem partners to identify assembly capability improvement roadmap PREFERRED EXPERIENCE: • Demonstrated leadership skills in managing OSATs and teams with various backgrounds • In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc.. • Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience. • Well verse in typical technology development tools, FMEA, SPC, control plans, etc.. • Ability to communicate well in both English and Chinese language ACADEMIC CREDENTIALS: • Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent. LOCATION: Hsinchu, Taiwan #LI-SC1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.