Product Engineering Lead

Аbout GlobalFoundries GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Key Responsibilities: • Own end-to-end New Product Introduction (NPI) execution for optical interconnect solutions from engineering prototypes through manufacturing release, production qualification, and volume ramp. • Drive manufacturing readiness for Co-Packaged Optics (CPO) and pluggable optics products, ensuring process flows, assembly methods, test coverage, tooling, documentation, and supplier readiness are in place before production release. • Develop and manage production test strategies, characterization plans, qualification plans, and release criteria for high-speed optical products supporting 100G, 200G, and 400G per lane architectures. • Lead cross-functional readiness reviews with design, device, packaging, assembly, test, reliability, quality, operations, and supply chain teams to identify risks, close gaps, and enable predictable product launches. • Translate product requirements and design intent into manufacturable, scalable, and repeatable production processes, including clear requirements for optical coupling, packaging, calibration, burn-in, final test, and outgoing quality control. • Define and track NPI milestones, build plans, qualification deliverables, yield targets, ramp metrics, and production release gates across EVT, DVT, PVT, qualification, and mass-production phases. • Lead yield optimization activities by analyzing electrical, optical, packaging, and assembly data; identifying dominant failure modes; and driving corrective actions with engineering, manufacturing, and supplier partners. • Own structured root-cause analysis and corrective-action closure for production excursions, qualification failures, reliability issues, and early ramp yield limiters. • Establish data-driven dashboards and reporting mechanisms to monitor test coverage, parametric distributions, yield trends, reliability performance, factory readiness, and production ramp health. • Partner with external OSATs, module manufacturers, component suppliers, and internal manufacturing sites to ensure process capability, quality controls, traceability, and ramp capacity are aligned with product launch objectives. • Support design-for-manufacturing, design-for-test, design-for-quality, and design-for-reliability reviews, ensuring lessons learned from prototype and ramp builds are fed back into product and process improvements. • Serve as the product engineering technical owner during production ramp, balancing quality, cost, yield, cycle time, manufacturability, and customer-readiness requirements. Required Qualifications: • Bachelor’s degree in Electrical Engineering, Photonics, Optical Engineering, or a related technical discipline; advanced degree preferred. • 10+ years of experience in product engineering, NPI, manufacturing engineering, test engineering, quality engineering, or production ramp for semiconductor, photonics, optical module, or high-speed interconnect products. • Demonstrated ownership of NPI programs from prototype builds through qualification, manufacturing release, and volume production ramp. • Strong understanding of optical interconnect products, including optical transceivers, silicon photonics, photonic integrated circuits, lasers, modulators, detectors, optical engines, optical coupling, packaging, and module assembly. • Experience with high-speed optical and electrical test methodologies, including production test development, calibration, test correlation, and data analysis. • Hands-on familiarity with optical and electrical measurement equipment such as BER testers, oscilloscopes, optical spectrum analyzers, optical power meters, network analyzers, thermal chambers, and automated test systems. • Experience developing qualification and reliability plans for telecom/datacom or semiconductor products, including environmental, mechanical, optical, electrical, and lifetime stress testing. • Proven ability to analyze yield data, identify systematic failure modes, lead root-cause analysis, and drive corrective actions across design, process, test, assembly, and supplier interfaces. • Experience working with OSATs, contract manufacturers, component suppliers, foundries, or global manufacturing sites in a high-complexity product environment. • Strong cross-functional leadership skills with the ability to influence engineering, operations, quality, reliability, supply chain, and executive stakeholders in a matrixed global organization. • Excellent written and verbal communication skills, with the ability to present technical risks, readiness status, yield trends, and ramp plans clearly to both technical and non-technical audiences. • Self-directed, structured, and detail-oriented, with the ability to operate effectively in ambiguous, fast-moving product-development environments. We Offer • Base Salary • Equity • Annual Bonus Plan • Medical Insurance Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/