Laser Module Technical Lead

Position Summary We are seeking a Senior or Principal Laser Module Tech Lead to lead the system architecture, integration, and technical execution of advanced laser modules for high-speed optical communication applications. This role will own the end-to-end performance of the laser module, ensuring seamless integration of semiconductor lasers, SOAs, silicon photonic PICs, optical packaging, electronics, firmware, and thermal management into a reliable, manufacturable product. As the technical lead, you will work across engineering disciplines and with external suppliers to deliver laser modules from concept through production. Key Responsibilities • Own the overall architecture and system performance of laser module products. • Define module-level requirements, interface specifications, and performance budgets. • Allocate optical, electrical, thermal, and mechanical performance targets across subsystem owners. • Lead integration of: • Semiconductor lasers (DFB, DBR, ECL, tunable) • SOAs • Silicon photonic PICs • Optical isolators, filters, and fiber interfaces • Driver electronics and control circuitry • Firmware for laser monitoring and control • Mechanical packaging and thermal solutions • Define characterization plans for optical power, wavelength, linewidth, SMSR, RIN, polarization, coupling efficiency, and thermal performance. • Lead system-level debugging and root-cause analysis of optical, electrical, and thermal issues. • Drive design tradeoffs balancing performance, manufacturability, reliability, and cost. • Work closely with laser, PIC, firmware, electrical, mechanical, and manufacturing teams to achieve system performance goals. • Collaborate with external suppliers on component specifications, qualification, and manufacturing readiness. • Support product qualification, reliability testing, and transfer to volume manufacturing. Required Skills & Experience: Required Qualifications • MS or PhD in Photonics, Optical Engineering, Electrical Engineering, Physics, or a related field. • Principal Level: 12–15+ years with demonstrated technical leadership. • Deep understanding of semiconductor lasers and laser module integration. • Experience integrating lasers with silicon photonic PICs. • Strong knowledge of optical packaging, fiber coupling, alignment, and assembly processes. • Experience with laser control electronics, TEC control, and monitoring photodiodes. • Familiarity with optical communication systems and module-level performance metrics. • Experience leading cross-functional engineering teams through product development. “Nice to have” Skills & Experience: Preferred Experience • External cavity and narrow-linewidth lasers • High-speed optical transmit engines • Co-packaged optics • 400G/800G/1.6T optical modules • Passive optical alignment and active alignment techniques • Automated manufacturing and production test development • Reliability qualification and failure analysis