Volantis Semiconductor 30

What We’re Looking For: We’re looking for verification engineers to contribute to and own blocks, sub-systems and potentially the entire wafer-level and cluster-level verification. Ideal Background: Ideal candidates will have: • Experie

What We’re Looking For: We’re looking for microarchitects to own key blocks in the A-0 and A-1 systems. You will work alongside the architects to translate specifications into implementable RTL and then work with the PD teams to turn it in

What We’re Looking For: We’re looking for DFT engineers to contribute to and own DFT efforts for blocks and entire dies on the A-0 and A-1 wafer-scale systems. Ideal Background: • Experience leading DFT efforts for multiple advanced node

What We’re Looking For: We’re looking for SoC architects to own the detailed SoC-level architecture of dies on the A-0 and A-1 wafer-scale systems. You will work with the architecture and ASIC design teams to create implementable specs and

What We’re Looking For: We’re looking for physical design engineers to help manage and execute the physical design process for the various dies that comprise our A-0 and A-1 systems. This will involve deciding what to do in-house and outso

What We’re Looking For: We’re looking for ASIC design engineers to contribute to and own blocks in the development of the A-0 and A-1 wafer products, across both the XPU, memory chiplet and other dies on the wafer. Ideal Background: An i

What We’re Looking For: We’re looking for an architect to own the NoC (network on chip) inside our XPU, as well as its integration into the broader network and system. Ideal Background: • Hands on experience in designing, integrating, ve

What We’re Looking For: We’re looking for architects to own key blocks on the A-0 and A-1 systems. This is a role with ownership of an entire sub-block, and you will need to understand how it fits into the entire system and work with other

What We’re Looking For: We’re looking for memory subsystem architects to contribute and own aspects of the memory subsystem for the largest and highest bandwidth memory system ever built to date. This includes the distributed memory fabric

What We’re Looking For: We’re looking for an architect to lead the design and implementation of the inter-wafer scale-up network. Connecting very high bandwidth and high capacity wafers into a “super-system” will enable previously unpreced

What We’re Looking For: We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers. Ideal Background: • Deep understanding and

What We’re Looking For: We’re looking for a lead architect to own a large portion of the system architecture of the A-0 and A-1 products. Ideal Background: An ideal candidate will have: • Experience leading the architecture of an entire

Job Title: Laser Design Engineer What We’re Looking For: We’re looking for laser design engineers to contribute to the designs of Gen 1 and 2 custom laser designs and the integration with the wafer-scale interposer. Ideal Background: An

What We’re Looking For: We’re looking for PIC (photonic integrated circuit) design engineers to contribute to and own aspects of the wafer-scale photonic interposer PIC. This will involve solving unique problems in creative ways, such as t

What We’re Looking For: We’re looking for an architect to own the logical architecture for the A-0 and A-1 wafer products. You will work with the XPU/Compute chip architect and the memory architect to synthesize the final wafer-level archi

What We’re Looking For: We’re looking for an XPU Architect to own the XPU compute engine architecture of the A-0 and A-1 systems. This will initially involve heavily leveraging existing 3rd party IP, but in a creative way to solve the band

What We’re Looking For: We’re looking for PCB design engineers to design and own various PCB boards that are components in the A-0 and A-1 system assemblies. Ideal Background: • Experience with high power density PCB design, validation a

What We’re Looking For: We’re looking for great analog and mixed signal circuit designers to join us in contributing to the design of our production optical PHY. Ideal Background: Ideal candidates will have: • Deep knowledge, hands on e

What We’re Looking For: We’re looking for link validation engineers to help with DVT and bringup of the core optical link and PHY. Ideal Background: Ideal candidates for this role should have: • Hands-on experience with the bringup and

What We’re Looking For: We’re looking for a PHY/SERDES Lead to own and lead the development of our semi-custom optical PHY layer. Ideal Background: • Multiple successful tapeouts of SERDES or PHY macros (not necessarily only chiplet inte

What We’re Looking For: We’re looking for power delivery system engineers to design the power delivery subsystem for our A-0 and A-1 systems. Because of the high power concentration of our wafer-scale system, this necessitates vertical po

We’re looking for power integrity engineers to ensure that power is delivered and stable at all levels: rack/tray, package, die, core. Ideal Background: • Experience with large die, high TDP chip PDN analysis and design • Experience with

What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an un

What We’re Looking For: We’re looking for thermal design engineers to build the cooling system for our photonic wafer-scale system. This involves unique thermomechanical challenges and will require solving problems differently than tradit

What We’re Looking For: We’re looking for mechanical design engineers to contribute to, and own aspects of the wafer-scale assembly, including the interactions between the power delivery system, mechanical chassis, heatsink and more. Idea

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced enginee

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer captu

Role Overview We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical

About the Role You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds Our end goal has challenges to overcome in