Advanced Packaging Technologist

MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession. Work Location: San Jose, CA or San Diego, CA Role and Responsibilities • Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production • Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements • Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution • Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues • Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management