Bachelor's/Master's Thesis: A comparative study of sinter pastes & preforms for inductive sintering

The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions. The increasing demand for compact and reliable power electronic systems drives the development of advanced die-attach technologies. Inductive sintering is a promising alternative to conventional soldering and offers fast, localized heating with reduced thermal exposure of surrounding components. Copper is particularly attractive as a sintering material due to its excellent electrical and thermal properties. In this Bachelor’s/Master’s thesis, copper sintering pastes and preforms will be investigated and compared for inductive die-attach applications. The study will focus on process performance, heating behaviour, bond-line consistency, joint quality, and porosity to evaluate the advantages and limitations of both material forms. We are looking for a motivated student to experimentally investigate and compare copper pastes and preforms for inductive sintering and contribute to the development of an efficient and reliable die-attach process.