Optical 3D Packaging Technologist

MediaTek is seeking an experienced technologist to join our global advanced packaging team. You will be a key contributor in the development of optical‑interconnect packaging and 2.5D/3D/3.5D packaging solutions (CoWoS, SoIC, COUPE, CPO, HBM, FCBGA) that support our AI, Datacenter/HPC product families. The role bridges internal cross‑functional groups, external customers, and technology providers to deliver optical and advanced packaging solution and roadmap from prove of concept (PoC) to high volume production (HVM). Roles and Responsibilities: • Develop and validate optical interconnect including Co-Package-Optics (CPO), Fiber Attachment Unit (FAU), Optical Engine (OE), etc. package/assembly solutions for 2.5D/3D/3.5D package architectures. • Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams to deliver optical interconnect technology. • Conduct DFM (Design‑for‑Manufacturability) analysis, generate design rule sets for 3DIC/CPO packages and documentations. • Collaborate with internal cross-functional partners, including, Technology, Design, Test, Quality, GSM and Manufacturing Operation to meet product requirements (RFI, RFQ) and execute MP plans. • Manage technology development, yield improvement, and production issue troubleshooting together with technology suppliers: Foundries, OSATs and substrate vendors. • Develop/establish fundamental optical characterization methodology for key components and package/assembly process • In charge of Package Qualification, New Product Introduction (NPI) and HVM.