Master's Thesis: Modeling and Simulation of Wafer Bonding Process

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes. Wafer bonding is a critical process in semiconductor manufacturing, enabling the integration of diverse materials and the creation of complex microsystems. A key phenomenon in this process is the bond wave – the progression of the bonding front across the interface. We are looking for a motivated Master’s student to develop a comprehensive numerical framework to predict bond wave propagation to start as soon as possible. This thesis aims to bridge the gap between traditional analytical models and advanced computational methods, specifically focusing on Finite Element Method (FEM).