NPI Engineer

NPI Engineer The Role We are seeking a highly skilled and motivated Process Engineering expert in Photonics to own the manufacturing process development for our state-of-the-art photonic products. This is a hands-on role responsible for bridging the gap between design and high-volume production. You will be a technical expert for our assembly and packaging processes, with a special focus on Silicon Photonics devices. Your primary mission will be to develop robust, scalable, and cost-effective manufacturing processes and transfer them successfully to our production partners. If you are a data-driven engineer who thrives on solving complex manufacturing challenges, this is the role for you. ‍ What You'll Do (Responsibilities) • Process Development & Optimization: Lead the hands-on development, characterization, and optimization of core assembly processes, including precision die bonding, wire bonding, and active/passive optical alignment. • High-Volume Scalability: Design, develop, and qualify manufacturing processes and equipment with a clear path to ramping to high-volume manufacturing (HVM). Define equipment specifications and drive the design of custom fixtures and tooling. • Statistical Process Control (SPC): Implement and manage SPC for critical process parameters. Use statistical methods (DOE, Cp/Cpk analysis) to monitor process health, drive yield improvements, and ensure manufacturability. • Silicon Photonics Assembly: Serve as the subject matter expert for the unique challenges associated with Silicon Photonics device assembly, including fiber attach, thermal management, and high-density interconnects. • Design for Manufacturability (DFM): Work closely with the design engineering team to provide critical DFM feedback, ensuring that new products are designed for robust, high-yield manufacturing. • Yield Improvement: Drive root cause analysis for yield excursions and process failures. Implement robust corrective and preventative actions to achieve and exceed yield targets. • Manufacturing Transfer: Create comprehensive documentation (work instructions, control plans, PFMEAs) and lead the technical transfer of new products and processes to our contract manufacturing (CM) partners. ‍ What You'll Bring (Qualifications) Minimum Qualifications: • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field. • 5+ years of experience in a process engineering or NPI role within the semiconductor, electronics, or photonics packaging industry. • Direct, hands-on experience developing and sustaining key assembly processes such as precision die bonding, wire bonding, optical alignment and wafer level processing • Demonstrated experience working with Silicon Photonics devices and their associated assembly and packaging processes. • Proficiency in applying Statistical Process Control (SPC) and Design of Experiments (DOE) to solve manufacturing problems. Preferred Qualifications: • Master’s degree or PhD in a relevant technical discipline. • A proven track record of successfully developing manufacturing processes and ramping them into high-volume manufacturing. • Deep expertise in materials (e.g., epoxies, solders) and characterization techniques used in microelectronic and photonic assembly. • Experience specifying, sourcing, and qualifying automated or semi-automated manufacturing equipment. • Experience with statistical analysis software such as JMP or Minitab. • Experience working with and managing offshore contract manufacturers (CMs). • Strong problem-solving skills and a hands-on, data-driven approach.