Thermal Engineer-Data Center AI GPU Thermal Design

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and play a key role in shaping the future of AI computing. This team owns the end-to-end thermal architecture, validation, and deployment of AMD's industry-leading MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of cutting-edge AI hardware, advanced cooling technologies, and large-scale data center infrastructure. This is an opportunity to collaborate with world-class engineers across silicon design, board engineering, validation, manufacturing, and product development while helping bring next-generation AI products to market. The successful candidate will contribute to thermal innovation from concept through production and gain hands-on experience with advanced cooling technologies that power some of the most demanding computing workloads in the world. The role offers a unique combination of hands-on laboratory work, thermal modeling, design analysis, and technology development in a fast-paced environment focused on solving complex engineering challenges and enabling AMD's AI roadmap. THE PERSON: The ideal candidate is a collaborative and technically curious engineer with a passion for solving complex thermal challenges. They are comfortable working in cross-functional environments, taking ownership of their work, and thrive when balancing hands-on experimentation with analytical problem-solving. Successful team members are self-starters who communicate effectively, execute against commitments, support their teammates, and continuously seek innovative solutions to emerging thermal and cooling challenges. Individuals who bring deep expertise in a specific thermal discipline while maintaining a team-first mindset tend to excel in this environment. KEY RESPONSIBILITIES: • Design and develop thermal solutions supporting AMD's next generation of data center GPU and AI accelerator products. • Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver innovative thermal-mechanical solutions from component to system level. • Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis. • Contribute to thermal modeling and simulation efforts to support product development and design optimization. • Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's future product roadmap. • Support product development activities from concept through commercialization and mass production. • During the first several months, become familiar with AMD thermal design methodologies, tools, products, and development processes while contributing to active engineering projects. • Over time, take ownership of critical thermal design and validation efforts, develop domain expertise, and become a key contributor to next-generation AI platform development. PREFERRED EXPERIENCE: • Strong background in heat transfer, fluid dynamics, and electronics cooling technologies. • Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments. • Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms. • Knowledge of air-cooled and liquid-cooled thermal design methodologies. • Experience with thermal laboratory testing, design of experiments (DOE), instrumentation, data acquisition, and data analysis. • Experience developing liquid cooling solutions including cold plates, liquid interconnects, manifolds, and related cooling technologies. • Familiarity with thermal design components such as thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and fans. • Experience with CAD tools such as SolidWorks or Creo. • Exposure to scripting, automation, or data analysis tools including Python, MATLAB, C/C++, or similar languages. • Internship, research, or industry experience related to data center infrastructure, semiconductor products, AI accelerators, GPUs, or hyperscale computing environments is highly desirable. ACADEMIC CREDENTIALS: • Master's degree or PhD preferred in Mechanical Engineering. • Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus are also desired. • Research focused on thermal management, fluid dynamics, electronics cooling, computational modeling, or related areas is preferred. LOCATION: Austin, Texas This role is not eligible for visa sponsorship. #LI-CS1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. THE ROLE: Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and play a key role in shaping the future of AI computing. This team owns the end-to-end thermal architecture, validation, and deployment of AMD's industry-leading MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of cutting-edge AI hardware, advanced cooling technologies, and large-scale data center infrastructure. This is an opportunity to collaborate with world-class engineers across silicon design, board engineering, validation, manufacturing, and product development while helping bring next-generation AI products to market. The successful candidate will contribute to thermal innovation from concept through production and gain hands-on experience with advanced cooling technologies that power some of the most demanding computing workloads in the world. The role offers a unique combination of hands-on laboratory work, thermal modeling, design analysis, and technology development in a fast-paced environment focused on solving complex engineering challenges and enabling AMD's AI roadmap. THE PERSON: The ideal candidate is a collaborative and technically curious engineer with a passion for solving complex thermal challenges. They are comfortable working in cross-functional environments, taking ownership of their work, and thrive when balancing hands-on experimentation with analytical problem-solving. Successful team members are self-starters who communicate effectively, execute against commitments, support their teammates, and continuously seek innovative solutions to emerging thermal and cooling challenges. Individuals who bring deep expertise in a specific thermal discipline while maintaining a team-first mindset tend to excel in this environment. KEY RESPONSIBILITIES: • Design and develop thermal solutions supporting AMD's next generation of data center GPU and AI accelerator products. • Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver innovative thermal-mechanical solutions from component to system level. • Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis. • Contribute to thermal modeling and simulation efforts to support product development and design optimization. • Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's future product roadmap. • Support product development activities from concept through commercialization and mass production. • During the first several months, become familiar with AMD thermal design methodologies, tools, products, and development processes while contributing to active engineering projects. • Over time, take ownership of critical thermal design and validation efforts, develop domain expertise, and become a key contributor to next-generation AI platform development. PREFERRED EXPERIENCE: • Strong background in heat transfer, fluid dynamics, and electronics cooling technologies. • Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments. • Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms. • Knowledge of air-cooled and liquid-cooled thermal design methodologies. • Experience with thermal laboratory testing, design of experiments (DOE), instrumentation, data acquisition, and data analysis. • Experience developing liquid cooling solutions including cold plates, liquid interconnects, manifolds, and related cooling technologies. • Familiarity with thermal design components such as thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and fans. • Experience with CAD tools such as SolidWorks or Creo. • Exposure to scripting, automation, or data analysis tools including Python, MATLAB, C/C++, or similar languages. • Internship, research, or industry experience related to data center infrastructure, semiconductor products, AI accelerators, GPUs, or hyperscale computing environments is highly desirable. ACADEMIC CREDENTIALS: • Master's degree or PhD preferred in Mechanical Engineering. • Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus are also desired. • Research focused on thermal management, fluid dynamics, electronics cooling, computational modeling, or related areas is preferred. LOCATION: Austin, Texas This role is not eligible for visa sponsorship. #LI-CS1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.