Senior Thermal Design Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a Thermal Engineer within the Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team, you will lead the thermal design, validation, and development of innovative cooling solutions for AMD's next-generation Data Center GPU products. Working across silicon, board, power, validation, manufacturing, and partner organizations, you will help deliver high-performance, reliable, and scalable thermal solutions from concept through production in one of AMD's most strategic growth markets. THE PERSON: The ideal candidate is a technically strong and collaborative engineer with expertise in electronics thermal management and product development. You excel at solving complex technical challenges, communicate effectively across diverse teams, and thrive in a fast-paced environment. You bring strong analytical, planning, and organizational skills, along with a passion for developing innovative thermal technologies that enable industry-leading data center products. KEY RESPONSIBILITIES: • Design and develop thermal solutions for next-generation AMD Data Center GPU products. • Partner with silicon, board, power, validation, and manufacturing teams to deliver chip-, card-, and system-level thermal-mechanical solutions. • Drive thermal design and validation activities throughout the product lifecycle, from concept through mass production. • Perform thermal characterization and validation of hardware at the chip, board, and system levels. • Evaluate emerging cooling technologies and collaborate with vendors and internal stakeholders to align solutions with future product roadmaps. • Improve engineering processes while supporting rapid, cost-effective product development and time-to-market objectives. PREFERRED QUALIFICIATIONS: • Strong foundation in heat transfer, fluid dynamics, and electronics cooling, including air- and liquid-cooling technologies. • Experience using CFD tools such as ANSYS Icepak, AEDT, or equivalent for thermal analysis and design. • Proficiency with CAD tools such as Creo and/or SolidWorks; experience implementing liquid-cooling designs is a plus. • Deep understanding of thermal management components, including TIMs, heat sinks, vapor chambers, heat pipes, cold plates, fans, and liquid distribution systems. • Experience with server, rack, and data center platform thermal design, validation, and liquid-cooling architectures. • Hands-on laboratory, data analysis, and scripting experience (Python, MATLAB, C/C++, or similar) with strong communication and cross-functional collaboration skills. ACADEMIC CREDENTIALS: • MS/PhD in Mechanical Engineering LOCATION: Sacaucus, NJ This role is not eligible for visa sponsorship. #LI-LC2 #LI-Hybrid Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. THE ROLE: As a Thermal Engineer within the Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team, you will lead the thermal design, validation, and development of innovative cooling solutions for AMD's next-generation Data Center GPU products. Working across silicon, board, power, validation, manufacturing, and partner organizations, you will help deliver high-performance, reliable, and scalable thermal solutions from concept through production in one of AMD's most strategic growth markets. THE PERSON: The ideal candidate is a technically strong and collaborative engineer with expertise in electronics thermal management and product development. You excel at solving complex technical challenges, communicate effectively across diverse teams, and thrive in a fast-paced environment. You bring strong analytical, planning, and organizational skills, along with a passion for developing innovative thermal technologies that enable industry-leading data center products. KEY RESPONSIBILITIES: • Design and develop thermal solutions for next-generation AMD Data Center GPU products. • Partner with silicon, board, power, validation, and manufacturing teams to deliver chip-, card-, and system-level thermal-mechanical solutions. • Drive thermal design and validation activities throughout the product lifecycle, from concept through mass production. • Perform thermal characterization and validation of hardware at the chip, board, and system levels. • Evaluate emerging cooling technologies and collaborate with vendors and internal stakeholders to align solutions with future product roadmaps. • Improve engineering processes while supporting rapid, cost-effective product development and time-to-market objectives. PREFERRED QUALIFICIATIONS: • Strong foundation in heat transfer, fluid dynamics, and electronics cooling, including air- and liquid-cooling technologies. • Experience using CFD tools such as ANSYS Icepak, AEDT, or equivalent for thermal analysis and design. • Proficiency with CAD tools such as Creo and/or SolidWorks; experience implementing liquid-cooling designs is a plus. • Deep understanding of thermal management components, including TIMs, heat sinks, vapor chambers, heat pipes, cold plates, fans, and liquid distribution systems. • Experience with server, rack, and data center platform thermal design, validation, and liquid-cooling architectures. • Hands-on laboratory, data analysis, and scripting experience (Python, MATLAB, C/C++, or similar) with strong communication and cross-functional collaboration skills. ACADEMIC CREDENTIALS: • MS/PhD in Mechanical Engineering LOCATION: Sacaucus, NJ This role is not eligible for visa sponsorship. #LI-LC2 #LI-Hybrid Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.