Packaging Manager/Director

Mediatek is seeking a visionary manager or director to join our US team for Advanced Packaging Development. In this strategic role, you will lead and drive the development of cutting-edge 2.5D/3D packaging solutions critical to our Automotive, Datacenter/HPC, AI, and Computing business units. You will serve as the key technical coordinator to bridge internal cross-functional teams, external customers, and external manufacturing partners. Your team’s mission is to solve complex integration challenges (CoWoS, EMIB, SoIC, HBM, FCBGA, FCCSP, HBPOP) and lead the packaging roadmap from concept through to mass production. We are looking for an owner who combines deep technical expertise with strategic thinking, supply chain management experience, and a solid commitment to customer obsession. Roles and Responsibilities: • Leadership and Development: Lead the development of advanced packaging technologies. Collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. • Supply Chain and Technical Partner Management: Establish and manage third-party relationships with substrate suppliers, OSATs, assembly, material and equipment partners. Drive material selection and BOM optimization to ensure manufacturability to meet electrical, mechanical, thermal, and system-level requirements. • Communication Skill: Monitor and report project progress, supply chain performance, and manufacturing metrics to senior management. Serve as the primary interface for external customers and key enablement partners to ensure alignment on product quality, reliability, system needs, and optional requirements. • Travel: Domestic and international travel required (10-15%) to closely collaborate with partners/supplies, customer engagements, and internal team alignment.