Advanced CPO Packaging Development & Integration Manager/Engineer

1. Advanced Packaging Technology Development. Lead the feasibility assessment and development of Co-Packaged Optics (CPO) and advanced wafer-level/panel-level packaging technologies, including 2.5D, 3D, 3.5D integration, EMIB, Fan-Out, and other heterogeneous integration solutions. 2. New Product Introduction (NPI) and Manufacturing Yield Enhancement. Drive NPI activities from engineering builds to production ramp-up, including process planning, DOE development, yield analysis, root-cause investigation, and manufacturing yield improvement. 3. Packaging Solution Development. Develop and implement packaging solutions for Co-Packaged Optics (CPO), optical modules, and advanced logic-memory integration platforms, including HBM and LPDDR technologies. 4. Technology and Supply Chain Management. Collaborate with foundries, OSAT providers, optical component suppliers, module manufacturers, and substrate vendors to evaluate technology capabilities, conduct technical assessments, support cost analysis, and oversee manufacturing readiness. 5. Cross-Functional Project Leadership. Work closely with IC design, package design, testing, quality, and reliability teams to ensure technical requirements, project milestones, and product performance targets are successfully achieved. #LI-JK1