Assembly and Packaging Process Engineer

About the role • We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.What you'll do • Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture • Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture • Project tracking weekly. • Write technical reports and present results. • Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use. • Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly. • Maintain the software and firmware support for testing and relevant setups.Required Qualifications • Minimal requirement is a bachelor's degree with 1 years of experience. • The successful candidate need have English communication capability. • Experience or knowledge of PCB assembly with SMT line • Hands-on experience in laboratory experimentation and data analysis • English communication capability is a must. • Familiar with Microsoft Office. • Fast learner is a must. • Good work ethics and Maintain company confidential information are a mustPreferred Qualifications • Higher degree with more experience is highly desired. • Experience with microelectronic device packaging. • Former experience of optical device packaging is highly desirable. • Experience with hands-on testing of photonic and electronic. device/components. • Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA. • Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. • Experience in SolidWorks and familiar with Engineering drawing is a plus. • Data analysis experience such as JMPs is a plus; excel is OK. • Programming and software maintenance skills are desired eg. python, or C++ • Understanding the microelectronic reliability tests and mechanical reliability tests are desirable. • Experience in microsystem assembly such as hard disk assembly is a plus.Benefits (subject to location and local regulations) • Competitive salary and equity • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team