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Package and Chip thermal/stress simulation engineer

MediaTek Inc

HsinChuPosted Aug 4, 2025
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MediaTek Inc
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1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation #LI-JK1

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Original posting: careers.mediatek.com

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RISC-V ecosystem

MediaTek Inc in the RISC-V ecosystem

RISC-V International: Strategic

We make semiconductor technology for #Smartphone, #IoT, #Network as well as TV, Tablet, Blu-ray & many other devices.

  • Named in coverage of RISE, the Linux Foundation Europe RISC-V Software Ecosystem project, and RISC-V edge-AI market analysis
  • Listed on the landscape as a RISC-V International member

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