Director of SoC Implementation / Physical Design

We are seeking a highly experienced leader to head SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex SoCs, driving delivery from RTL to silicon for cutting-edge technology nodes. The ideal candidate combines deep technical expertise with strong organizational leadership, capable of managing large global teams and delivering high-quality silicon on aggressive schedules. Key Responsibilities 1. End-to-End Physical Design Ownership • Lead complete SoC physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff. • Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness. • Deliver optimized PPA (Power, Performance, Area) across complex designs. • Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency 2. Program & Execution Leadership • Own planning, tracking, and execution of physical design programs from specification through tapeout. • Manage risks, dependencies, and schedules across multi-site global teams. • Drive cross-functional alignment across RTL, DFT, STA, verification, and packaging teams. • Ensure delivery to aggressive project timelines and quality metrics. 3. Team Leadership & Organization Development • Build and lead high-performing global physical design teams. • Drive hiring, mentoring, and career development across technical leads and engineers. • Establish execution discipline, review mechanisms, and performance tracking. • Interface with senior leadership for status reporting, escalation, and decision-making. 4. Technical Strategy & Innovation • Define and deploy next-generation physical design methodologies. • Drive automation, flow optimization, and tool innovation. • Lead adoption of advanced node technologies (5nm and beyond). • Improve scalability, productivity, and design quality through methodology enhancements. 5. Cross-Functional & Ecosystem Engagement • Collaborate with architecture, RTL, verification, and product teams to ensure design convergence. • Interface with EDA vendors and IP providers for tool and flow optimization. • Support post-silicon bring-up, yield improvement, and production ramp activities. Core Technical Expertise • Full RTL-to-GDSII implementation flow • Floorplanning, synthesis, PNR, CTS, routing • STA and signoff methodologies • EM/IR, PDN design, signal integrity • Physical verification (DRC/LVS/ERC) • Advanced node implementation (≤ 16nm / 5nm) • Low power design (UPF/CPF) • System-level integration (package, IO, board) These responsibilities reflect core physical design tasks such as floorplanning, PNR, STA, verification, and optimization defined in internal role descriptions Required Qualifications • Bachelor’s or Master’s in Electrical / Electronics Engineering or related field • 17+ years of experience in ASIC / SoC physical design • Proven experience leading large-scale SoC programs • Strong knowledge of industry EDA tools (Synopsys, Cadence flows) • Demonstrated success in advanced node implementations • Strong leadership, communication, and stakeholder management skills Preferred Qualifications • Experience in automotive or high-reliability SoCs • Expertise in PDN / EMIR / SI closure at chip-level • Experience with global team leadership across geographies • Exposure to AI-driven design methodologies and automation More information about NXP in the United States... NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-6692