Research Associate: Interconnect Technologies (all genders)

Developing innovative technology solutions and bringing them to application - that is our goal at the Fraunhofer Institute for Photonic Microsystems IPMS. Our »Center Nanoelectronic Technologies« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI (ultra-large-scale integration) level in the areas of front-end (FEoL) and back-end-of-line (BEoL) for various CMOS technology nodes. The associated Interconnect Technologies group, which is part of our Neuropmorphic Computing business unit, focuses on technologies for metallization in the BEOL (back end of line) of CMOS manufacturing and the border area to advanced packaging. The core theme of the group is the creation of copper lines through electrochemical deposition (ECD) and chemical mechanical polishing (CMP), as well as all wet chemical cleaning steps.