Director, Advanced Power Silicon & Packaging Technology

Position Summary The Director of Advanced Power Silicon & Packaging Technology leads the strategy, architecture, development, and deployment of next-generation power delivery technologies spanning silicon, package, and system integration. This role is responsible for driving innovation in power semiconductors, advanced packaging, and silicon-package-system co-optimization for AI, datacenter, networking, and high-performance computing platforms. The director partners across silicon design, packaging, architecture, manufacturing, and product organizations to deliver breakthrough improvements in power efficiency, power density, performance, reliability, and total cost of ownership. Key Responsibilities Technology Strategy & Vision • Define and execute the long-term roadmap for:Advanced power silicon technologiesAdvanced packaging and heterogeneous integrationChip-package-system co-designVertical power delivery solutions • Identify disruptive technologies and assess strategic investment opportunities. • Drive technology differentiation and competitive advantage. Power Silicon Leadership • Drive adoption of advanced semiconductor technologies including:GaN power devicesSiC technologiesAdvanced CMOS and BCD power processes • Optimize power efficiency, die area, and reliability. Advanced Packaging Leadership • Establish packaging technology roadmaps for:2.5D and 3D packagingChiplet architecturesSilicon interposersFan-out packagingEmbedded power deliveryCo-packaged solutions • Lead package electrical, thermal, and mechanical optimization. • Drive package innovations enabling higher power density and lower power delivery losses. Silicon-Package-System Co-Design • Lead cross-functional initiatives to optimize:Power integrity (PI)Signal integrity (SI)Thermal performanceElectromigration reliabilityPower delivery network (PDN) • Develop end-to-end power architectures from regulator to transistor. Research & Innovation • Lead advanced technology incubation and proof-of-concept programs. • Build strategic partnerships with:Semiconductor foundriesOSAT partnersEDA vendorsUniversities and research institutions • Create and manage intellectual property portfolios. • Drive patent generation and technical publications. Organizational Leadership • Establish a culture of technical rigor, innovation, accountability, and execution excellence. • Mentor senior technical leaders and develop organizational capability. Required Qualifications Education • BS in Electrical Engineering, Physics, Materials Science, or related discipline. • MS or PhD preferred. Experience • 15+ years of semiconductor and power technology experience. • 6+ years leading technology, architecture, or engineering organizations. • Proven success delivering innovative silicon and packaging technologies from concept through production. Technical Expertise Power Silicon • Power semiconductor devices • Power integrity analysisAdvanced Packaging • Chiplet integration • 2.5D/3D packaging • Fan-out technologies • Silicon interposers • Package reliability and qualificationSystems Knowledge • Power delivery networks • Thermal management • Manufacturing and supply chain considerations Preferred Qualifications • Expertise in:Vertical power deliveryBackside power distribution networksEmbedded voltage regulation • Strong patent portfolio and industry recognition. • Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations. More information about NXP in Greater China... #LI-67af