Engineer Package Technology Development

Engineer Package Technology Development Your role Key responsibilities in your new role • Coordinate and drive Infineon's Chip Embedding package developments at a subcontractor in China as local technical expert and representative. • Interact with local engineering and production teams as well as management levels • Support and drive subcon team wrt problem solving as well as quality, yield and process improvements. • Ensure execution of Infineon's product projects according to timeline, yield and quality targets. Your profile Qualifications and skills to help you succeed • >10 yrs experience in PCB manufacturing and packaging development • Experienced in problem solving and execution of development projects • Held a senior position in a development and/or manufacturing environment. • Strong leadership skills and confident demeanor. • Very good communication skills in Mandarin and English. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Lucy.Shi@infineon.cn