Support Engineer / Hardware Lab & Board Rework Engineer

Company: Qualcomm India Private Limited Job Area: Engineering Services Group, Engineering Services Group > Support Engineering General Summary: We are seeking a hands-on Hardware Support Engineer to support board assembly, rework, hardware bring-up, debugging, inventory management, and prototype enablement activities for wireless and networking platforms. The candidate will work closely with Hardware, Software, Validation, DVT, and cross-geo engineering teams to ensure timely board readiness and project execution. Key Responsibilities Board Assembly & Rework • Perform BGA, QFN, DRQFN, MRQFN, DRQFN, DDR, FEM, PoP package, filter, and fine-pitch component mounting. • Execute complex board-level rework, modifications, blue-wire fixes, and component replacement activities. • Support chip mounting, package replacement, soldering, re-balling, and board recovery activities. • Ensure high-quality workmanship with maximum yield and minimal rework cycles. Hardware Bring-up & Debug Support • Support Pre-SoD and Post-SoD board enablement activities. • Assist engineering teams in board bring-up, debugging, and issue resolution. • Work with HW, SW, DVT, and other SW validation teams to enable critical programme milestones. • Support failure analysis and board resurrection activities. Prototype & Lab Operations • Coordinate prototype board movement, tracking, and inventory management. • Maintain board and component inventory records. • Ensure timely availability of boards for engineering teams and project milestones. • Support logistics and board preparation activities for local and remote teams. Advanced Assembly Activities • Re-ball BGAs, DDR interposers, raiser cards, RF FEMs, filters, and specialised components. • Perform precision soldering and micro-assembly work using microscope & other lab equipment. • Develop and optimise solder profiles for various package types. Quality & Process Compliance • Verify completed assembly and rework activities. • Maintain high workmanship standards and process compliance. • Drive continuous improvement in rework quality, delivery, and turnaround time. • Follow ESD, safety, and laboratory operating procedures. Required Skills • Hands-on experience in PCB assembly and board rework. • Expertise in BGA rework stations, hot-air systems, microscopes, and soldering tools. • Knowledge of RF modules, DDR devices, PoP assembly, and fine-pitch components. • Ability to read schematics, board layouts, and rework instructions. • Strong troubleshooting and debugging skills. • Good communication and teamwork skills. • Positive attitude, strong sense of ownership, and ability to collaborate effectively with cross-functional teams in a fast-paced engineering environment. • Team player with good communication skills • Customer and milestone-oriented approach Minimum Qualifications: • Bachelor's degree and 4+ years of Support Engineering or related work experience. OR Associate's degree and 5+ years of Support Engineering or related work experience. OR High School Diploma or equivalent and 6+ years of Support Engineering or related work experience. *Completed advanced degrees in a relevant field may be substituted for up to two years (Master’s = one year, Doctorate = two years) of work experience. Preferred Qualifications • Diploma/B.E. in Electronics, ECE, EEE, Instrumentation, or related discipline. • 5+ years of experience in hardware lab support, board rework, or prototype engineering. • Experience supporting wireless, networking, RF, or embedded hardware platforms. • Knowledge of SMT processes and solder profile optimization. Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. 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