← Back to roles

Advanced Packaging Principal Engineer (EMIB/2.5D/3D)

MediaTek Inc

HsinChuSoC / ASICPosted Apr 19, 2026
Apply on MediaTek Inc

Overview

MediaTek Inc
Open roles
628
At this company
See all
Similar roles
3
Same title, 3 companies
Search
1. 2.5D/3.5D package technology development​ 2. SoC/Memory heterogeneous integration package development​ 3. Package technology integration, NPI and MP​ 4. Project management​

Apply on the employer's site

Original posting: careers.mediatek.com

Apply on MediaTek Inc

RISC-V ecosystem

MediaTek Inc in the RISC-V ecosystem

RISC-V International: Strategic

We make semiconductor technology for #Smartphone, #IoT, #Network as well as TV, Tablet, Blu-ray & many other devices.

  • Named in coverage of RISE, the Linux Foundation Europe RISC-V Software Ecosystem project, and RISC-V edge-AI market analysis
  • Listed on the landscape as a RISC-V International member

Same employer

More roles at MediaTek Inc

View all 628