Engineer, Process (Die Prep)

Position Summary The Process Engineer (Die Prep) is responsible for development and establishment of production process. Responsibilities • Establish, review and update specifications, workflow, quality and safety related documentation for Die Prep (Backgrind, Dicing, Laser Grooving, etc) processes within production line. • Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage. • Process sustaining and control through SPC and periodic defect Pareto Analysis. • Lead and drive SPC control • Review and maintain FMEA, Control plan, OCAP with cross-functional teams. • Handle and manage customer audits and 8D reports. • Provide disposition for engineering and production lots. • Conduct process characterization and qualification to establish process baseline. • Coordinate and liaise with vendor/suppliers on process issue or quality issue. • Support customer NPI activities and internal engineering activities. • New material, process & machine development and qualification. • Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line Requirements • Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline • Experience in Semiconductor manufacturing industry and working in cleanroom environment • Minimum 3 years hands-on Die Prep process such as Backgrind, Dicing, Laser Grooving within semiconductor / electronics manufacturing industry • Experience in SPC, DOE, FEMA, and 8D reports