SG-01-SINGAPORE-010 ~ 10 Loyang Cres ~ 10 LOYANG CRES-010, Phase 12026-09-21
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36,250 open roles across 332 companies · 4,297 added this week
521 results · page 11 of 21 · dates: UTC
- US-MA-TEWKSBURY-TB3 ~ 50 Apple Hill Dr ~ CONCORD BLDG, Tewksbury Tb3 300 Concord2026-09-21
Principle Engineer - SoC Design Verification
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLVerificationSoC / ASICFPGA2026-09-21Director of FE Engineering - SoC MCU
NXP Semiconductors Netherlands B.V.
Yokneam IlitRTL / HDLVerificationSoC / ASIC2026-09-21Senior Lead Engineer - SoC Design Verification
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLVerificationSoC / ASICFPGA2026-09-21Senior Lead Engineer - SoC Design Verification
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLVerificationSoC / ASICFPGA2026-09-21Lead Engineer - SoC Design Verification
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLVerificationSoC / ASICFPGA2026-09-21Senior Lead Engineer - SoC Design Verification
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLVerificationFirmwareSoC / ASIC2026-09-21Senior Principal Engineer SoC Design
NXP Semiconductors Netherlands B.V.
PuneRTL / HDLPhysical designSoC / ASICSecurity2026-09-21Lead Design Engineer, SoC Design
NXP Semiconductors Netherlands B.V.
PuneSoC / ASIC2026-09-21Lead Product Engineer: SoC Verification
Cadence Design Systems, Inc.
BELO HORIZONTERTL / HDLVerificationFirmwareSoC / ASIC2026-09-21Systems/SOC Architecture, Senior to Staff
Qualcomm Technologies, Inc.
Markham, Ontario, CanadaSoC / ASIC2026-09-21- US-MA-TEWKSBURY-TB3 ~ 50 Apple Hill Dr ~ CONCORD BLDG, Tewksbury Tb3 300 ConcordSoC / ASIC2026-09-20
Senior System Software Engineer, SOC
NVIDIA Corporation
Taiwan, Taipei, Taiwan, HsinchuKernel / LinuxFirmwareSoC / ASIC2026-09-18SoC Physical Design Engineer (Senior/Lead)
Qualcomm Technologies, Inc.
Bangalore, IndiaRTL / HDLCompilersPhysical designSoC / ASIC2026-09-18SOC RTL Design Engineer - Staff
Qualcomm Technologies, Inc.
Hyderabad, Telangāna, IndiaRTL / HDLFPGA2026-09-18Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Austin, Texas, United States of America, Boxborough, Massachusetts, United States of America, Tempe, Arizona, United States of America, Santa Clara, California, United States of AmericaRTL / HDLVerificationFirmwarePhysical design2026-09-18Validation Lead-Fuse/SoC
Advanced Micro Devices (AMD)
MARKHAM, CanadaFirmwareSoC / ASIC2026-09-17Senior SoC Design Verification Engineer
Quadric.io
Pune, Maharashtra, INDIARTL / HDLVerificationFirmwareSoC / ASIC2026-09-17Associate Product Quality Engineer
Analog Devices, Inc.
US, CA, San Jose, Rio Robles2026-09-17Associate Product Quality Engineer
Analog Devices, Inc.
US, MA, Wilmington2026-09-17SOC Design Engineer
Qualcomm Technologies, Inc.
Markham, Ontario, Canada, Toronto, Ontario, Canada, Vancouver, British Columbia, CanadaRTL / HDLVerificationCompilersSoC / ASIC2026-09-17Lead Performance Modeling Engineer – GPU SoC
Advanced Micro Devices (AMD)
Bangalore, IndiaSoC / ASIC2026-09-16CDI - Senior SoC Digital Design Engineer – Digital Image Sensor F/H
STMicroelectronics International N.V.
Grenoble, FranceRTL / HDLVerificationFirmwareSoC / ASIC2026-09-15Associate Analog Design Engineer
Analog Devices, Inc.
US, AZ, Chandler, East Elliot2026-09-15
