Senior Principal Packaging Engineer
NXP Semiconductors Netherlands B.V.
Chandler (Office)SoC / ASIC2026-10-14
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132 results · page 2 of 6 · dates: UTC
Senior SI/PI Engineer (High-Speed Systems)
Qualcomm Technologies, Inc.
Hsinchu City, Taiwan2026-10-14Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Austin, Texas, United States of America, California Bay Area - Remote, United States of America, Irvine, California, United States of America, Oregon - Remote, United States of AmericaRemoteRTL / HDLSoC / ASIC2026-10-13RF Package Design Engineer, Senior Staff
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-10-13Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Austin, TexasSoC / ASIC2026-10-12Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Santa Clara, CaliforniaSoC / ASIC2026-10-12Senior Packaging Engineer
Microsoft Corporation
Malaysia, Pulau Pinang, Gelugor2026-10-12Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
MARKHAM, CanadaFirmwareSoC / ASIC2026-10-09- Stuttgart2026-10-09
Sr. Director of Packaging Engineering
Advanced Micro Devices (AMD)
San Jose, CaliforniaSoC / ASIC2026-10-08Mechanical Engineering & System Packaging Co-Op (Spring 2027)
The Charles Stark Draper Laboratory, Inc.
Cambridge, MA2026-10-07SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
Singapore, Singapore2026-10-07Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-05Staff Engineer, Thermal
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-10-05- US-CA-EL SEGUNDO-R01 ~ 2000 E Imperial Hwy ~ BLDG R012026-10-02
Packaging development engineer
NXP Semiconductors Netherlands B.V.
Kuala Lumpur2026-09-30Packaging Technology Integration, Senior Staff Engineer
Qualcomm Technologies, Inc.
Singapore, Central Singapore, Singapore2026-09-30Internship/Thesis‒Sustainable Ingredients Production (Process Development & Scale-Up) (all genders)
Fraunhofer Gesellschaft
Freising2026-09-29Thesis - Sensory Analytics and Technologies (all genders)
Fraunhofer Gesellschaft
Freising2026-09-29Senior Engineer, Semi Packaging Engineering
Analog Devices, Inc.
Taiwan, Vendor2026-09-25Sr. Staff Packaging Engineer- Process Package Integrity & Bumping
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaPhysical design2026-09-25Senior Hardware Engineer - QPU Packaging
Oxford Quantum Circuits
Reading, England, United Kingdom2026-09-25- Daresbury, England2026-09-24
Advanced Packaging Technologist (Mechanical Modeling)
Advanced Micro Devices (AMD)
Austin, Texas2026-09-22Senior Engineer, Semi Packaging Engineering
Analog Devices, Inc.
US, MA, Wilmington2026-09-22
