Senior Staff Engineer / Principal Engineer Automotive Package Concepts
Infineon Technologies AG
Singapore2026-09-04
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119 results · page 4 of 5 · dates: UTC
Advanced Package Technology, Principal Engineer
Marvell Asia PTE Ltd
Hsinchu CityPhysical designSoC / ASIC2026-09-03Package PI/SI Engineer
Rebellions
SoC / ASIC2026-08-30- San JoseVerification2026-08-27
Senior Staff Engineer Package Technology
Infineon Technologies AG
Melaka2026-08-262027 Masters ASIC Package Engineering Co-op/Intern
Advanced Micro Devices (AMD)
Austin, Texas; Boxborough, Massachusetts; Fishkill, New York; Fort Collins, Colorado; Longmont, Colorado; Secaucus, New JerseyVerificationSoC / ASIC2026-08-252027 Masters ASIC Package Engineering Co-op/Intern
Advanced Micro Devices (AMD)
Santa Clara, California; San Jose, CaliforniaVerificationSoC / ASIC2026-08-252027 Undergrad ASIC Package Engineering Co-op/Intern
Advanced Micro Devices (AMD)
Austin, Texas; Boxborough, Massachusetts; Fishkill, New York; Fort Collins, Colorado; Longmont, Colorado; Secaucus, New JerseyVerificationSoC / ASIC2026-08-252027 Undergrad ASIC Package Engineering Co-op/Intern
Advanced Micro Devices (AMD)
San Jose, California; Santa Clara, CaliforniaVerificationSoC / ASIC2026-08-25Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)
Qualcomm Technologies, Inc.
Kaohsiung, Kaohsiung (obsolete), Taiwan, Taichung, Taichung City, TaiwanSoC / ASIC2026-08-25Senior Staff Engineer Package Technology
Infineon Technologies AG
Melaka2026-08-21Scientist - Package design engineer (all genders)
Silicon Austria Labs GmbH
VillachFirmwareSoC / ASIC2026-08-21Package Layout Engineer
Lightmatter
Mountain View, CAPhysical designSoC / ASIC2026-08-19Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development )
MIPS Tech LLC.
OFFSITE, Hsinchu County, Taiwan2026-08-11Senior Package Layout Engineer - Hardware
NVIDIA Corporation
US, CA, Santa Clara, US, NV, Remote, US, WA, Remote, US, AZ, Remote, US, OR, Remote, US, CA, RemoteRemoteSoC / ASIC2026-08-06- HsinChu2026-08-04
- HsinChu2026-08-04
Process Development Engineer - mold + grinding/laser mark/ball attach/package saw
STMicroelectronics International N.V.
Muar, Malaysia2026-07-31Senior Engineer - IC Package Design
Qualcomm Technologies, Inc.
Bangalore, India2026-07-31Package Reliability Engineer (f/m/d)
Black Semiconductor
Aachen, GermanyRemote2026-07-30Package Design Methodology Engineer
NVIDIA Corporation
US, CA, Santa Clara, US, TX, Austin, US, CA, RemoteRemotePhysical designSoC / ASIC2026-07-27【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer
Qualcomm Technologies, Inc.
Hsinchu City, TaiwanPhysical design2026-07-26Package Design Engineer - Staff
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaVerificationPhysical designSoC / ASIC2026-07-23- Bangalore, Karnātaka, India2026-07-22
Staff / Senior Staff Engineer Package Technology Development
Infineon Technologies AG
Singapore2026-07-10
