SoC HW Systems Engineer — Packaging & IO
Infineon Technologies AG
Bangalore (India)SoC / ASIC2026-08-19
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132 results · page 4 of 6 · dates: UTC
Senior Packaging Technical Engineer - Hardware
NVIDIA Corporation
US, CA, Santa Clara, US, TX, Remote, Remote - USRemoteRTL / HDLPhysical design2026-08-18Senior Signal Integrity Engineer – LPU Packaging
NVIDIA Corporation
US, CA, Santa ClaraSoC / ASIC2026-08-17Senior Packaging Technical Engineer - Hardware
NVIDIA Corporation
Taiwan, HsinchuRTL / HDLPhysical design2026-08-14Signal and Power Integrity Engineer, Senior to Staff Level
Qualcomm Technologies, Inc.
Hsinchu City, Taiwan2026-08-14CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H
STMicroelectronics International N.V.
Grenoble, France2026-08-13Staff Failure Analysis Engineer - Advanced Packaging Technologies
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaSoC / ASIC2026-08-13Senior Photonics Packaging Engineer
Xscape Photonics
Santa Clara2026-08-12RF Electromagnetic (EM) Engineer - San Diego
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-08-12Packaging Integration Engineer
MIPS Tech LLC.
Essex Junction, Vermont, United States of America2026-08-11- Leuven, Flemish Brabant, Belgium2026-08-11
- Essex Junction, Vermont, United States of AmericaSoC / ASIC2026-08-11
- Essex Junction, Vermont, United States of AmericaSoC / ASIC2026-08-11
Advanced Packaging Modeling Engineer
MIPS Tech LLC.
Malta, New York, United States of America2026-08-11Sr. Staff Thermo-Mechanical Engineer
Lightmatter
Mountain View, CA2026-08-09Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
Austin, TexasFirmware2026-08-06Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaFirmware2026-08-06Semiconductor Packaging Engineer
Analog Devices, Inc.
US, MA, Wilmington2026-08-04Electrical Packaging Design Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaFirmwareFPGA2026-08-03IC Packaging Design & Layout Engineer
The Charles Stark Draper Laboratory, Inc.
Cambridge, MAPhysical design2026-07-31Staff Engineer, Semi Packaging Engineering
Analog Devices, Inc.
US, MA, Wilmington2026-07-31Senior IC Packaging Engineer
Avicena
🇺🇸 Sunnyvale, CASoC / ASIC2026-07-31Senior Engineer - IC Package Design
Qualcomm Technologies, Inc.
Bangalore, India2026-07-31Principal IC Packaging Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-07-29- Research & development - Eindhoven2026-07-28
