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36,212 open roles · 332 companies hiring

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36,212 open roles across 332 companies · 4,345 added this week

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7 results · dates: UTC

Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
2026-10-21
SAN JOSE2026-10-21
Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
2026-10-21
SAN JOSE2026-10-21
SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
2026-10-07
Singapore, Singapore2026-10-07
Principal 3D-heterogeneous integration engineer
MIPS Tech LLC.
2026-09-11
Essex Junction, Vermont, United States of America, Malta, New York, United States of America2026-09-11
MTS Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
2026-09-02
Singapore, Singapore2026-09-02
JEDI NCG 3D Heterogeneous Integration Engineer - Quantum Cryogenic 3D packaging
MIPS Tech LLC.
2026-08-11
Leuven, Flemish Brabant, Belgium2026-08-11
3D Heterogeneous Integration Engineer (2026 New College Graduate)
MIPS Tech LLC.
2026-08-11
Malta, New York, United States of America2026-08-11