Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-28
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103 results · page 1 of 5 · dates: UTC
Senior IC Packaging Process Engineer
NVIDIA Corporation
Israel, YokneamSoC / ASIC2026-10-27Staff Engineer, Semi Packaging Engineering
Analog Devices, Inc.
US, CA, San Jose, Rio Robles2026-10-26Sr Staff Engineer, Power Delivery
Qualcomm Technologies, Inc.
Austin, Texas, United States of AmericaPhysical designSoC / ASIC2026-10-26Sr. Engineering Technician - Packaging Lab
NXP Semiconductors Netherlands B.V.
Austin (Oakhill, Office)2026-10-23- Sedgefield, Durham2026-10-23
Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
SAN JOSE2026-10-21Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
SAN JOSE2026-10-21Packaging Engineer, Substrate
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-20Staff IC Packaging Engineer - Mechanical Simulation
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-10-20- San Jose, CaliforniaSoC / ASIC2026-10-20
- Singapore2026-10-20
Senior Packaging Engineer
Microsoft Corporation
United States, Washington, Redmond2026-10-19Mechanical Engineer-Server Systems, Compute Hardware, Electronics Packaging
Advanced Micro Devices (AMD)
Secaucus, New JerseyFirmware2026-10-18- 🇺🇸 Sunnyvale, CA2026-10-17
Packaging SIPI Engineer, Sr. Staff
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-10-16- Engineering - LeuvenSoC / ASIC2026-10-15
- US-CA-EL SEGUNDO-R01 ~ 2000 E Imperial Hwy ~ BLDG R012026-10-15
Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, TaiwanSoC / ASIC2026-10-15Packaging Design Engineer
Advanced Micro Devices (AMD)
Austin, TexasSoC / ASIC2026-10-14Senior Principal Packaging Engineer
NXP Semiconductors Netherlands B.V.
Chandler (Office)SoC / ASIC2026-10-14Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Austin, Texas, United States of America, California Bay Area - Remote, United States of America, Irvine, California, United States of America, Oregon - Remote, United States of AmericaRemoteRTL / HDLSoC / ASIC2026-10-13RF Package Design Engineer, Senior Staff
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-10-13Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Austin, TexasSoC / ASIC2026-10-12Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Santa Clara, CaliforniaSoC / ASIC2026-10-12
