Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
SAN JOSE2026-10-21
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- Austin, TXPhysical designSoC / ASIC2026-10-20
Sr. Staff/Principal Advanced Packaging Architect
MediaTek Inc
San Jose, CASoC / ASIC2026-10-13Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Austin, Texas, United States of America, California Bay Area - Remote, United States of America, Irvine, California, United States of America, Oregon - Remote, United States of AmericaRemoteRTL / HDLSoC / ASIC2026-10-13Voltage Regulator (VR) Architect
Qualcomm Technologies, Inc.
San Diego, California, United States of America2026-09-01- San JoseRTL / HDLSoC / ASIC2026-08-27
Senior Network Architect, Advanced Packaging
NVIDIA Corporation
Israel, Tel Aviv2026-08-17Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
Austin, TexasFirmware2026-08-06Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaFirmware2026-08-06Packaging Architect
MediaTek Inc
San Jose, CASoC / ASIC2026-06-10
