Electrical Signal Processing ASIC Design for Imaging Spectrometers

The Challenge Imaging spectrometers capture both spatial and spectral information for applications such as material identification, environmental monitoring, and industrial sensing. Their performance depends not only on optical filters and photodetectors but also on the electrical readout and signal processing circuits. Designing compact imaging spectrometers requires efficient readout integrated circuits (ROICs) and controller architectures that provide accurate signal acquisition while maintaining low noise, high dynamic range, and low power consumption. This project explores electrical signal processing ASIC architectures for imaging spectrometers, focusing on the integration of photodetector readout, signal conditioning, and mixed-signal circuit design. System-level modeling and circuit simulations will be used to evaluate the interactions between optical response, detector characteristics, and electrical readout performance. What You Will Do You will get the chance to: Investigate ROIC and controller ASIC architectures , including detector biasing, signal integration, amplification, sampling, and analog-to-digital conversion. Develop behavioral and circuit-level models to evaluate electrical signal processing requirements and system performance. Design and simulate analog and mixed-signal circuits for photodetector interfaces using appropriate EDA tools. Evaluate optical–electrical system trade-offs , including noise, dynamic range, spectral accuracy, acquisition speed, and power consumption. Support circuit verification and prototype evaluation , potentially including layout-related activities and experimental characterization. Your design work will be supported by system-level analysis and circuit simulations to understand how electrical design choices influence imaging spectrometer performance. You will also have the opportunity to collaborate with experienced researchers and engineers in an international multidisciplinary research environment. Requirements The project offers experience in analog and mixed-signal ASIC design, sensor interface circuits, and electrical signal processing for imaging spectrometers. A background in electrical engineering, electronic circuits, semiconductor devices, or integrated circuit design is desirable. Experience with circuit simulation tools, Verilog/SystemVerilog, Python, or MATLAB is an advantage. The balance between architecture development, circuit design, and system-level analysis can be adjusted to the candidate's background and interests. A strong command of English is essential for effective communication. Time Distribution 40% ASIC architecture and circuit design, 30% modeling and simulation, 20% verification and characterization, 10% literature study and reporting Type of internship : Master internship Duration : 12months Required educational background : Electrotechnics/Electrical Engineering University promotor : Jan Genoe (KU Leuven) Supervising scientist(s) : For further information or for application, please contact Jaewon Nam ( Jaewon.Nam@imec.be ) and Gokhan Kara ( Gokhan.Kara@imec.be ) The reference code for this position is 2026-INT-325 . Mention this reference code in your application. Only for self-supporting students. Applications should include the following information: resume motivation current study Incomplete applications will not be considered