Engineering roles in Belgium at 6 companies, collected from the employers' own careers pages. Every role links to the original posting.
Overview
Counted from the engineering roles this board lists in Belgium on 28 Oct 2026. A skill counts when a posting names it.
Roles 1–30 of 192, newest first.
Senior DTCO DRAM Periphery Circuit Designer / Architect What you will do In this position, you will join imec’s memory design and pathfinding activities and take a leading role in the design and exploration of advanced DRAM periphery circ
R&D Test Engineer – 3D Integration and Interconnect Characterization and Automation What you will do As a Test Engineer within imec's Electrical and Optical Test Solutions (EOTS) department, you will develop and execute electrical charact
Layout & Test R&D Engineer What you will do Join our photonics R&D pilot line developing advanced transfer printing technologies and photonic integrated circuits (PICs). In this hybrid role, you will combine hands-on wafer-scale optoelect
FPGA R&D Engineer What you will do Design, implement, verify and integrate FPGA solutions using VHDL and/or Verilog. Develop high-speed digital interfaces such as PCIe, DDR, Ethernet, CSI-2, JESD204, Aurora and other serial transceiver-ba
R&D Wafer-to-Wafer bonding engineer What you will do In this role, you will help develop the next generation of wafer bonding technologies that enable future logic, memory, photonic, RF and heterogeneous integration applications. The posi
Process Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of integrated circuits, and the advent of more compact system integration te
Researcher Source/Drain Epitaxy What you will do As a member of the Epitaxial Growth group (EPI), which leads imec’s research in semiconductor epitaxy, you will: Develop processes enabling the growth of highly doped epitaxial materials, i
Team Leader for Calibration Products Engineering About the Role IMEC's unique position, infrastructure and R&D capabilities enable it to produce calibration wafer products for advanced semiconductor process and tool calibration. Customers
Fab Reporting Business Analyst As a Fab Reporting Business Analyst, you enable imec's Pilot Lines and Operations teams to make better and faster decisions through trusted operational data, analytics, and reporting solutions. You act as the
Process Integration Engineer PWD The Product and Wafer delivery group (PWD) is looking for a process integration engineer to help build and deliver a growing volume of high value niche products for some of IMEC’s strategic partners. Having
NXP Semiconductors Netherlands B.V.
Job Summary NXP Semiconductors Belgium is seeking a Principal System Engineer to lead the architectural definition, design, and implementation of complex embedded systems, ensuring cutting-edge performance and reliability for our next-gener
NXP Semiconductors Netherlands B.V.
Senior IC Verification Engineer, Ready to shape the future of intelligent semiconductor systems at NXP? At NXP, we develop advanced semiconductor solutions that help make the world smarter, safer, more secure and more sustainable. As part
Director, Product Industrialisation and Low Volume Production Delivery (PID) The Product Industrialisation and Low Volume Production Delivery (PID) department specialises in industrialisation and low-volume production of high-complexity sil
Principal Investigator in Ionics and Iontronic devices We are looking for a Principal Investigator with deep scientific and hands-on expertise in ionics and solid-state iontronic devices. Relevant fields include electrolyte-gated and ion-in
Thermal-Mechanical Expert for Printed Circuit Board Assemblies and Electronic Systems As a Thermal-Mechanical Simulation Expert, you will play a crucial role in the design and optimization of electronic printed circuit board assemblies for
At imec, we develop advanced electronic devices based on emerging 2D semiconductor materials such as MoS₂, WSe₂, and WS₂. These technologies are being explored for future low-power and high-performance electronics using device structures ra
The growing demand for energy-efficient data storage and computing is driving the development of non-volatile memory technologies. Magnetic Random Access Memory (MRAM) is a promising candidate, combining non-volatility with fast operation a
Scanning probe microscopy (SPM) is a powerful technique for characterizing materials and devices at the nanometre scale , but the measurement quality depends directly on the SPM tip . Blunt, irregular, or multi-contact tips produce convolut
Extreme ultraviolet (EUV) lithography serves as the bedrock patterning technology that produces the world’s most advanced nanoelectronic structures and devices. While EUV lithography is already adopted in high-volume manufacturing of advanc
Photoacoustic sensing and imaging use absorbed optical energy to generate acoustic waves. Depending on the application, light may interact with gases, liquids, tissue, or other materials. The generated pressure waves then propagate through
Scanning Electron Microscopy (SEM) is an essential metrology technique in semiconductor manufacturing, enabling high-resolution imaging of device structures and material layers. Both top-view and cross-sectional SEM inspections are widely u
Two-dimensional semiconductors such as monolayer MoS₂ are leading candidates for transistor channels that could be co-integrated with silicon in beyond CMOS devices. In a channel only three atoms thick, every processing step counts: wet-che
RISC-V CPU Power and Performance Modelling for imec’s Future Semiconductor Technologies As semiconductor technologies and chip architectures are becoming increasingly complex, understanding the interaction between technology and architectur
At imec, we are in the unique position to develop materials characterization solutions for the future generation semiconductor technologies. Often overlooked, this is a crucial component in achieving the ambitious goals depicted on our road
Photonics systems deployed across different application domains require long-term operational stability. In optical communication, wavelength-division multiplexed (WDM) channels must remain precisely aligned to their designated wavelengths,
What you will do As semiconductor devices continue to scale, understanding the atomic-scale environment of dopant atoms is increasingly important for controlling activation and device performance. During this internship, you will analyze lo
Title: Machine Learning-Based Defect Classification and Anomaly Detection in Advanced IC Package 3D Interconnects Using Scanning Acoustic Microscopy Technical Description: As transistor scaling approaches its physical limits, advanced packa
Title: Physics-Based Acoustic Wave Modeling and Subsurface Warpage Reconstruction for Advanced Semiconductor Packages Technical Description: As transistor scaling approaches its physical limits, advanced packaging has become essential to dr
As the rapid expansion of artificial intelligence (AI) drives demand for higher-capacity memory solutions, the semiconductor industry is exploring novel memory architectures beyond conventional DRAM. The most promising approach is 3D-DRAM ,
Developing hardware for AI is both costly and technically demanding. The software stack evolves rapidly and is often optimized around GPUs. These realities raise a fundamental challenge: how can one validate hardware that does not yet exist
