Senior Staff Engineer Unit Process Development Plating

#WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Staff Engineer Unit Process Development in our Research & Development team, you'll have theopportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your role Key responsibilities in your new role • Lead or support technical handover and knowledge transfer activities to Operations. • Support the build of prototype and development samples. • Generate and maintain relevant documentation, including Process Specifications, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR. • Provide input for the update of related documents and ensure the accuracy of their content, including Process of Record, Assembly Design Rules, Process Roadmap, Failure Catalogue, Control Plan, Maintenance Checklist, and Unit Process Roadmap for development projects. • Collaborate with suppliers to drive continuous improvement and perform verification and qualification activities for new tooling, equipment, and materials within development projects. • Serve as the technical lead for task forces and complex problem-solving teams, utilizing statistical and analytical tools such as SPC, APC, DOE, 8D, FMEA, and DFMEA. Your profile Qualifications and skills to help you succeed • Master's Degree or Bachelor's Degree in Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, or related Engineering disciplines. • 12 years of experience in semiconductor manufacturing, with at least 8 years of direct experience in plating process development or advanced surface finishing technologies. • Demonstrated track record in process qualification, technology transfer, yield improvement, root cause analysis, and manufacturing ramp-up activities. • Strong knowledge of electroplating and electroless plating fundamentals, chemical process development, surface finishing technologies, process characterization and failure analysis, Design of Experiments (DOE), Statistical Process Control (SPC), FMEA and risk assessment, MSA and process capability studies, as well as semiconductor backend assembly processes. • Proven expertise in lead frame technology and high-density power package manufacturing. • Knowledge of automation, Industry 4.0 applications, data analytics, and AI-assisted process optimization is an added advantage #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.