Principal Engineer Cross Platform Technology Integration

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Cross Platform Technology Integration, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your role Key responsibilities in your new role In this role, you will harmonize Technology Integration activities across multiple platforms, driving synergy through the implementation of best practices and the sharing of technical expertise. You will provide Technology Integration leadership for cross-platform technology projects, ensuring alignment, effective collaboration, and successful execution of key development objectives. • Act as a TI lead for new technology involving more than one platforms • Responsible in PBC and TPC assessment • Owner of Risk Interaction assessment and mitigation work packages • Integration ownership of Pre-development for new Chip technology that involved multiple platforms • Harmonize the Integration of unit processes (BOM and Process) and new chip technology involving different package platforms • Working partner for FE in FE/BE interaction and integration topics • Act as a driver/team member for 8D/problem-solving for interaction issues • Drive synergy, best practice implementation and sharing of lesson learnt across platforms • Provide technical guidance/assistance when needed in the projects related to interaction topic Your profile Qualifications and skills to help you succeed You strive to leverage your strong expertise in semiconductor packaging, assembly, testing, and technology interactions to drive effective collaboration, problem-solving, and technical integration across diverse stakeholders and platforms. You demonstrate proficiency in structured methodologies such as 8D, DFMEA/PFMEA, DOE, and reliability analysis to identify risks, optimize processes, and deliver robust engineering solutions. • Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) • At least 10 years of working experience in IC/semiconductor environment • Strong Semiconductor Packaging, Assembly and Test knowledge • Good aptitude for communication, collaboration, negotiation, and solution finding • Experience in FE/BE and BE/BE Interactions • Possess knowledge of 8D & T6s methodology • Possess knowledge of DFMEA/PFMEA • Experience in Internal Package analysis/ first level reliability • Possess knowledge of DOE & Comparative methods #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.