Advanced MCM Packaging Technology Development & Integration

1. Advanced Technology & Architecture Development: Lead feasibility assessment and development of advanced packaging technologies for wafer-level and panel-level applications, including 2.5D/3D/3.5D integration and Fan-out packaging. 2. New Product Introduction (NPI) & Mass Production Improvement: Plan pilot production processes, design and execute DOE (Design of Experiments), lead yield analysis and engineering issue resolution, and drive yield improvement for mass production. 3. Application-Specific Packaging Solutions: Develop packaging solutions for logic and high-bandwidth memory integration, including HBM and LPDDR. 4. Supply Chain & Outsourced Manufacturing Management: Manage technical collaboration with wafer foundries, OSATs, and substrate suppliers, including technical evaluation, cost structure analysis, and production line audits. 5. Cross-Functional Project Leadership: Lead cross-functional collaboration across IC design, layout, testing, quality assurance, and reliability teams to ensure projects meet technical targets and schedule requirements. #LI-JK1