Package, Assembly, Test (PAT) Team Lead

About the role • We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.What you'll do • Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production. • Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies. • Working with HQ team to support device packaging process improvement with Cp and Cpk increase. • Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin. • Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production. • Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and system reliability tests. • Write technical documentation for test implementation, reports, and present results to internal and external stakeholders. • Intime make technical and project decision. • Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures • Manage and expand the Asia operation team when needed.Required Qualifications • Minimal requirement is a bachelor's degree with 12 years of experience. • Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA. • Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. • A fast learner is a must. • Good work ethics and maintaining the company’s confidential information are a must.Preferred Qualifications • A higher degree with more experience is highly desired. • Experience on optoelectronic device tests such as those for optical engines in pluggable modes and pluggable modules is a plus. • Experience and knowledge of silicon photonic devices and IIIV CoC reliability is a huge plus. • Experience of the setup and implementation of tests for NPI and volume production is a big plus. • Experience in the process of automation and test automation is a plus. • Data analysis experience such as JMPs is a plus;Benefits (subject to location and local regulations) • Competitive salary and equity • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team