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Lead Principal Engineer Package Technology

Infineon Technologies AG

MelakaPosted Oct 28, 2026
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Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology. Your role Key responsibilities in your new role • PBC and TPC assessment. • Driver of Package Technology DFMEA Process of Record. • Owner of Risk Interaction assessment and mitigation work packages. • Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow. • Working partner for FE in FE/BE interaction and integration topics. • Support Pre development for new Chip technology. Your profile Qualifications and skills to help you succeed • Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge. • Good aptitude for communication, collaboration, negotiation and solution finding. • Knowledge of FE/BE and BE/BE Interaction. • Knowledge of 8D & T6s methodology. • Knowledge of DFMEA/PFMEA. • Knowledge of Internal Package analysis/ first level reliability. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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Original posting: jobs.infineon.com

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RISC-V ecosystem

Infineon Technologies AG in the RISC-V ecosystem

RISC-V International: Premier Board

Infineon Technologies AG is a German semiconductor manufacturer founded in 1999, when the semiconductor operations of the parent company Siemens AG were spun off.

  • Brought RISC-V to automotive: first to announce an automotive RISC-V microcontroller family
  • Showed a virtual prototype/virtual automotive RISC-V chip with Synopsys for early software development

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