Master internship - Leuven2026-10-17
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[NanoIC topic] Pulsed Atomic Layer Etching for Next‑Generation Spintronic memory and Quantum Devices
imec
Master internship - Leuven2026-10-17[NanoIC topic] Pulsed Atomic Layer Etching for Next‑Generation Spintronic memory and Quantum Devices
imec
Master internship - Leuven2026-10-17- US-CA-ONTARIO-R27 ~ 1120 S Vineyard Ave ~ BLDG R272026-10-14
AstraZeneca Non-Clinical PhD Studentship in Next-generation TPD for oncology: Harnessing ubiquitin-independent pathways
University of Cambridge
Department of Pharmacology2026-10-13- US-CA-ONTARIO-R27 ~ 1120 S Vineyard Ave ~ BLDG R272026-10-10
- US-CA-EL SEGUNDO-E01 ~ 2000 E El Segundo Blvd ~ BLDG E01Firmware2026-10-07
Next Gen, High-Speed, Memory and Cache Controller Design Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationPhysical designSoC / ASIC2026-10-07Next-Gen System Cache ASIC Digital Design Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationSoC / ASIC2026-10-07PhD Candidate in Single-Stage Power Supply Unit for next generation AI Datacenters
Department of Computer Science, NTNU
trondheim2026-10-07Senior Chip Architect, Next Gen Networking
NVIDIA Corporation
Israel, Tel Aviv, Israel, Raanana, Israel, YokneamRTL / HDLVerificationFirmwareSoC / ASIC2026-10-06Next Generation SoC Integration Solution Lead
NXP Semiconductors Netherlands B.V.
NoidaRTL / HDLCompilersFirmwarePhysical design2026-10-02Modem HW Design Engineer – AI Driven Next Gen Modem Hardware Development
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLFirmwareSoC / ASIC2026-09-29EPSRC FIBE3 CDT PhD studentship with Tracey Concrete: Next generation low-carbon crack-resistant precast shaft and tunnel segments
University of Cambridge
Department of Engineering2026-09-28Senior Product Manager — Embedded AI and Next-Gen Computing
NVIDIA Corporation
US, CA, Santa Clara2026-09-23- US-IA-CEDAR RAPIDS-107 ~ 400 Collins Rd NE ~ BLDG 107Firmware2026-09-21
Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer (
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationPhysical designSoC / ASIC2026-09-21Next Gen CPU Power Management RTL Design Engineer
Advanced Micro Devices (AMD)
Santa Clara, CaliforniaRTL / HDLFirmwarePhysical designSoC / ASIC2026-09-18Next-Gen, High-Speed HBM, LPDDR Memory Controller ASIC Digital Design Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationPhysical designSoC / ASIC2026-09-01Modem Hardware Design Verification Engineer – AI Driven Next Gen Modem Hardware Development, Staff
Qualcomm Technologies, Inc.
Boxborough, Massachusetts, United States of AmericaRTL / HDLVerificationFirmware2026-09-01Next Generation Fellow (Fixed Term)
University of Cambridge
Department of Physiology, Development and Neuroscience2026-08-11PhD Positions in Neurotechnology: Next Generation Non-invasive Neurotechnologies & Brain Therapies
ETH Zurich
100%, Zurich, fixed-term2026-08-11Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationPhysical designSoC / ASIC2026-08-052027 Term 1 Internship – Next-Gen Server Test & Qualification
Advanced Micro Devices (AMD)
Singapore, SingaporeSoC / ASIC2026-07-31Next-Gen, High-Speed Memory Subsystem ASIC Digital Design Engineer
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaRTL / HDLVerificationSoC / ASIC2026-07-30
