Quantum PDK Design Manual Engineer
MIPS Tech LLC.
Malta, New York, United States of America, Essex Junction, Vermont, United States of America2026-09-19
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Senior Chip Design Engineer
NVIDIA Corporation
Israel, Beer ShevaRTL / HDLPhysical design2026-09-18Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Austin, Texas, United States of America, Boxborough, Massachusetts, United States of America, Tempe, Arizona, United States of America, Santa Clara, California, United States of AmericaRTL / HDLVerificationFirmwarePhysical design2026-09-18RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027
Qualcomm Technologies, Inc.
San Diego, California, United States of America, Tempe, Arizona, United States of America, Irvine, California, United States of America, Santa Clara, California, United States of AmericaRTL / HDLPhysical designSoC / ASIC2026-09-18FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months)
Qualcomm Technologies, Inc.
Toronto, Ontario, CanadaRTL / HDLVerificationFirmwarePhysical design2026-09-18FY27 Intern - MSIP Digital Design Verification Engineering Internship - Canada (16 months)
Qualcomm Technologies, Inc.
Toronto, Ontario, CanadaRTL / HDLVerificationFirmwarePhysical design2026-09-18Staff Engineer, Analog Design
MIPS Tech LLC.
Richardson, Texas, United States of AmericaSoC / ASIC2026-09-18Senior/Staff Digital Design Engineer
MediaTek Inc
CairoRTL / HDLVerificationSoC / ASIC2026-09-17Integration Design Engineer
Lattice Semiconductor Corporation
Manila, PhilippinesRTL / HDLVerificationPhysical designFPGA2026-09-17- TaipeiVerificationSoC / ASIC2026-09-17
Senior Engineer, Analog Design Engineering
Analog Devices, Inc.
Taiwan, Taipei, SonggaoRTL / HDL2026-09-17FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months)
Qualcomm Technologies, Inc.
Toronto, Ontario, CanadaRTL / HDLPhysical designSoC / ASIC2026-09-17RISCV CPU Design Verification Principal Manager/ Engineer
Qualcomm Technologies, Inc.
Bangalore, IndiaRISC-VRTL / HDLVerificationFPGA2026-09-17Principal Advanced Packaging Design Engineer
Marvell Asia PTE Ltd
Burlington, VT2026-09-16Principal Mixed Signal Design Engineer
Analog Devices, Inc.
US, MA, WilmingtonSoC / ASIC2026-09-16Manager, Project Management - Chip Design
NVIDIA Corporation
Israel, Tel AvivRTL / HDLVerificationFirmwarePhysical design2026-09-15SoC Design Implementation Engineer (Up to Principal Level)
Qualcomm Technologies, Inc.
Ho Chi Minh, Hồ Chí Minh, VietnamRTL / HDLVerificationPhysical designSoC / ASIC2026-09-15FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months)
Qualcomm Technologies, Inc.
Markham, Ontario, CanadaRTL / HDLVerificationFirmwareSoC / ASIC2026-09-15- 🇺🇸 Redwood CityRTL / HDLPhysical designSoC / ASIC2026-09-14
- 🇨🇦 TorontoRTL / HDLPhysical designSoC / ASIC2026-09-14
RTL / Circuit IP Design Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaRTL / HDLVerificationFirmware2026-09-14- HsinChuFirmware2026-09-14
Principal Engineer for Digital Design (f/m/div)
Infineon Technologies AG
CorkRTL / HDLPhysical design2026-09-14SoC Design Verification Engineer (Up to Principal Level)
Qualcomm Technologies, Inc.
Ho Chi Minh, Hồ Chí Minh, VietnamRTL / HDLVerificationFirmwarePhysical design2026-09-14Analog Engineer, Principal
Qualcomm Technologies, Inc.
Toronto, Ontario, CanadaRTL / HDLSoC / ASIC2026-09-11
