Internship - AI-driven Solution for Product Engineering Work Packages
Infineon Technologies AG
Singapore2026-07-09
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119 results · page 5 of 5 · dates: UTC
Work Package Manager
Thales SA
Singapore, Singapore2026-07-09IC Package Layout Engineer, Staff
Qualcomm Technologies, Inc.
Hsinchu City, TaiwanVerificationPhysical designSoC / ASIC2026-07-06Senior Co-Packaged Optics Process Engineer
NVIDIA Corporation
Taiwan, Hsinchu, Taiwan, Taipei2026-07-03Lead Engineer, 3D Integration & Advanced Packaging
Quantum Motion
London, UK2026-06-30- Cannes, Alpes-Maritimes, France2026-06-12
- Engineering - HeilbronnPhysical designSoC / ASIC2026-06-11
Package Development/NPI Engineer
MediaTek Inc
San Jose, CA2026-06-09IC Package Senior Engineer/Technical Manager
MediaTek Inc
HsinChu2026-04-29Senior Package Engineer
NVIDIA Corporation
Taiwan, Hsinchu, Taiwan, Taipei, Remote - TaiwanRemoteSoC / ASIC2026-04-243DIC Advance Package Design Engineer
MediaTek Inc
HsinChu2026-04-15- HsinChu2026-03-30
Ubuntu Package Management - Engineering Manager
Canonical Group Limited
Home based - WorldwideFirmware2026-03-18Senior Staff Engineer Package Technology
Infineon Technologies AG
Melaka2026-02-09Senior Hardware Manager, Co Package Optics Switch Design
NVIDIA Corporation
Israel, Yokneam, Israel, RaananaFirmware2026-01-22Senior Package Layout Engineer
NVIDIA Corporation
Taiwan, HsinchuSoC / ASIC2025-09-05- HsinChu2025-08-04
Senior Package Design Engineer
MediaTek Inc
HsinChu2025-02-20- Vancouver, BC OR Bay Area, CASoC / ASIC2023-05-05
