US-FL-MELBOURNE-310 ~ 1100 W Hibiscus Blvd ~ BLDG 3102026-10-26
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- US-TX-MCKINNEY-513WD ~ 2501 W University Dr ~ WING D BLDGVerification2026-10-26
- US-PR-AGUADILLA-110 ~ Rd 110 N Km 28.8 ~ RD1102026-10-26
Field Application Engineer, South East Asia
Tenstorrent
Kuala Lumpur, MalaysiaRISC-VCompilersKernel / Linux2026-10-26Sr. Technical Support Engineer
Advanced Micro Devices (AMD)
Austin, Texas2026-10-26Technical Support Engineer - CSS Azure Specialized
Microsoft Corporation
Romania, Bucharest, BucharestFirmware2026-10-26- London, UK2026-10-26
Lead Principal Engineer Product Definition and Platform Methodology (f/m/div)
Infineon Technologies AG
MunichSoC / ASIC2026-10-26Senior Software Engineer
Microsoft Corporation
Canada, British Columbia, Vancouver2026-10-26- Bengaluru, Karnataka, IndiaRISC-VRTL / HDLCompilersPhysical design2026-10-26
Senior Engineer - CPU DV
SiFive
Hyderabad, IndiaRISC-VRTL / HDLVerification2026-10-26- Hyderabad, IndiaRISC-VRTL / HDLVerification2026-10-26
- Hyderabad, IndiaRISC-VRTL / HDLVerificationSoC / ASIC2026-10-26
Principal Digital Design Engineer - MCU
NXP Semiconductors Netherlands B.V.
CataniaRTL / HDLVerificationCompilersPhysical design2026-10-26- Hyderabad (SEZ)2026-10-26
- Hyderabad (SEZ)2026-10-26
- Hyderabad (SEZ)2026-10-26
- Hyderabad (SEZ)2026-10-26
Logic Design Engineer
NXP Semiconductors Netherlands B.V.
KanataRTL / HDLVerificationPhysical designSoC / ASIC2026-10-26Principal Hardware Engineer
Marvell Asia PTE Ltd
Santa Clara, CAFirmwareSoC / ASIC2026-10-26Senior Design Verification Engineer (IP)
Lattice Semiconductor Corporation
Penang, MalaysiaRTL / HDLVerificationFPGA2026-10-26Design Engineering Architect
Cadence Design Systems, Inc.
BANGALORESoC / ASIC2026-10-26Staff Engineer, Semi Packaging Engineering
Analog Devices, Inc.
US, CA, San Jose, Rio Robles2026-10-26Principal Engineer Product Definition Engineering (f/m/div)
Infineon Technologies AG
MunichSoC / ASIC2026-10-26- Research & development - Gent Zwijnaarde2026-10-26
