Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-28
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Senior Staff Advanced Packaging Design Engineer
Marvell Asia PTE Ltd
Burlington, VT2026-10-27- Sedgefield, Durham2026-10-23
Advanced Packaging Design - SI/PI Engineer
Marvell Asia PTE Ltd
Westborough, MAPhysical design2026-10-22Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
SAN JOSE2026-10-21Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
SAN JOSE2026-10-21Packaging Engineer, Substrate
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-20Mechanical Engineer-Server Systems, Compute Hardware, Electronics Packaging
Advanced Micro Devices (AMD)
Secaucus, New JerseyFirmware2026-10-18Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, TaiwanSoC / ASIC2026-10-15Packaging Design Engineer
Advanced Micro Devices (AMD)
Austin, TexasSoC / ASIC2026-10-14Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Austin, TexasSoC / ASIC2026-10-12Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
Santa Clara, CaliforniaSoC / ASIC2026-10-12Sr. Manager Packaging Engineering
Advanced Micro Devices (AMD)
MARKHAM, CanadaFirmwareSoC / ASIC2026-10-09Sr. Director of Packaging Engineering
Advanced Micro Devices (AMD)
San Jose, CaliforniaSoC / ASIC2026-10-08SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
Singapore, Singapore2026-10-07Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, Taiwan2026-10-05Advanced Packaging Technologist (Mechanical Modeling)
Advanced Micro Devices (AMD)
Austin, Texas2026-09-22- Research & development - Hokkaido2026-09-18
Principal Advanced Packaging Design Engineer
Marvell Asia PTE Ltd
Burlington, VT2026-09-16- HsinChu2026-09-13
Packaging Engineer
Advanced Micro Devices (AMD)
Suzhou, ChinaSoC / ASIC2026-09-07Senior Staff Advance Packaging Designer
Advanced Micro Devices (AMD)
Singapore, SingaporeSoC / ASIC2026-09-04MTS Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
Singapore, Singapore2026-09-02Advanced Packaging Senior Engineer
Marvell Asia PTE Ltd
Bucharest, Romania2026-08-28- San JoseRTL / HDLSoC / ASIC2026-08-27
