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12 results · dates: UTC

Product Engineering Architect (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
2026-10-21
SAN JOSE2026-10-21
Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)
Cadence Design Systems, Inc.
2026-10-21
SAN JOSE2026-10-21
SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
2026-10-07
Singapore, Singapore2026-10-07
Packaging Technology Integration, Senior Staff Engineer
Qualcomm Technologies, Inc.
2026-09-30
Singapore, Central Singapore, Singapore2026-09-30
Integration engineer Silicon Photonics, Advanced Assembly and 3D Packaging (Japan)
imec
2026-09-18
Research & development - Hokkaido2026-09-18
Advanced CPO Packaging Development & Integration Manager/Engineer
MediaTek Inc
2026-09-13
HsinChu2026-09-13
MTS Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
MIPS Tech LLC.
2026-09-02
Singapore, Singapore2026-09-02
Packaging Integration Engineer
MIPS Tech LLC.
2026-08-11
Essex Junction, Vermont, United States of America2026-08-11
JEDI NCG 3D Heterogeneous Integration Engineer - Quantum Cryogenic 3D packaging
MIPS Tech LLC.
2026-08-11
Leuven, Flemish Brabant, Belgium2026-08-11
Packaging Design Integration Engineer (2026 New College Graduate)
MIPS Tech LLC.
2026-08-11
Essex Junction, Vermont, United States of AmericaSoC / ASIC2026-08-11
Packaging Integration Engineer (2026 New College Graduate)
MIPS Tech LLC.
2026-08-11
Essex Junction, Vermont, United States of AmericaSoC / ASIC2026-08-11
Lead Engineer, 3D Integration & Advanced Packaging
Quantum Motion
2026-06-30
London, UK2026-06-30