Device Engineer

**Job Title** Device Engineer **Role Summary** As a Device Engineer at Avicena, you will drive the design, fabrication, electro-optical characterization and qualification of GaN microLED devices at the heart of our LightBundle™ interconnect platform. You will translate device physics into manufacturable, high-yield emitters that meet aggressive targets for efficiency, speed, and array uniformity, working across the full stack from epitaxy and process integration to on-wafer test. **Key Responsibilities** - **Electro-optical characterization:** Design and execute L-I-V, spectral, modulation-bandwidth, and reliability-relevant measurements on single devices and large arrays; correlate results to design and process parameters. - **Device design & modeling:** Develop and optimize GaN-based microLED device structures, including epitaxial layer stacks, active regions, and contact schemes, using TCAD and analytical models to hit efficiency, bandwidth, current-density and reliability targets. - **Performance improvement:** Diagnose loss mechanisms (non-radiative recombination, sidewall effects, current crowding) and drive design/process changes to improve wall-plug efficiency and high-speed performance. - **Cross-functional collaboration:** Partner with epitaxy, process, packaging, test, and systems teams to align device performance with link-level and product requirements. - **Fabrication & integration:** Define and refine process flows in collaboration with process integration and foundry partners; own device-level design-of-experiments from wafer to characterization. - **Documentation:** Establish device specifications, test plans, and technical reports; contribute to IP generation and internal design reviews. **Required Qualifications** - **Education:** MS or PhD in Electrical Engineering, Applied Physics, Materials Science, Photonics, or a related field (or BS with equivalent industry experience). - **Experience:** 5–8+ years of hands-on experience in semiconductor optoelectronic or LED/laser device engineering. - **Device fundamentals:** Strong grasp of compound-semiconductor device physics, including carrier transport, recombination, and optical emission. - **Characterization:** Proven expertise in electro-optical device characterization and data analysis (L-I-V, spectral, high-speed/modulation measurements). - **Process fluency:** Working knowledge of semiconductor fabrication processes (lithography, etch, deposition, metallization) and their impact on device performance. - **Tools:** Proficiency with data analysis and scripting tools (e.g., Python, MATLAB) and TCAD or equivalent device simulation. **Preferred Qualifications** - **GaN microLEDs:** Prior hands-on experience with GaN-based microLED devices is strongly preferred but not required. - High-speed / high-bandwidth LED or VCSEL device experience for optical interconnect or display applications. - Experience with large-area or high-density emitter arrays and array-level uniformity/yield. - Familiarity with heterogeneous integration or hybrid bonding to CMOS. - Track record of patents or peer-reviewed publications in optoelectronic devices.